Title:
TRANSFER SUBSTRATE OF MICRO-LEDS AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/237511
Kind Code:
A1
Abstract:
A transfer substrate of Micro-LEDs and a preparation method therefor. The transfer substrate comprises: a support plate (1), and a bonding adhesive layer (2) disposed on the support plate (1); and a plurality of bonding rubber bumps (3) are formed on the side surface of the bonding adhesive layer (2) away from the support plate (1). By means of forming the plurality of bonding rubber bumps (3) on the surface of the bonding adhesive layer (2), the bonding rubber bumps (3) can deform and are used for bonding connection with Micro-LEDs, and internal stress generated by inhibiting the bonding of a bonding adhesive and the Micro-LEDs on a warped epitaxial growth substrate is dispersed, thus reducing the amount of stress on the bonding adhesive layer (2), so that when the Micro-LEDs and the transfer substrate are temporarily bonded, the bonding adhesive can more completely adhere the Micro-LEDs, thereby reducing the differences in adhesive force at the center and the periphery of a temporary substrate caused by the warping of the epitaxial growth substrate, so that the Micro-LEDs on the epitaxial growth substrate can all bond with the bonding adhesive on the transfer substrate, thus eliminating the phenomenon of bonding rings.
Inventors:
ZHAI FENG (CN)
TANG BIAO (CN)
TANG BIAO (CN)
Application Number:
PCT/CN2020/092610
Publication Date:
December 02, 2021
Filing Date:
May 27, 2020
Export Citation:
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L33/00; H01L21/683
Foreign References:
| CN111199907A | 2020-05-26 | |||
| CN207116403U | 2018-03-16 | |||
| CN111063650A | 2020-04-24 | |||
| CN107799455A | 2018-03-13 | |||
| KR20140122861A | 2014-10-21 |
Attorney, Agent or Firm:
JOHNSON INTELLECTUAL PROPERTY AGENCY(SHENZHEN) (CN)
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