Title:
TRIODE PACKAGING METHOD AND TRIODE
Document Type and Number:
WIPO Patent Application WO/2018/113747
Kind Code:
A1
Abstract:
Provided are a triode packaging method and a triode, for use in resolving the problems in an existing triode of large occupied space and low packaging efficiency. The method comprises: providing a carrier (10), and covering at least one surface of the carrier with a surface metal layer (11); covering a circuit pattern region of the surface metal layer with a resist film (12); electroplating a non-circuit pattern region of the surface metal layer to form at least one first bonding pad (13); welding a chip (14) on the at least one first bonding pad; welding a second bonding pad (15) on the chip to form a triode template; performing plastic packaging on the triode template by using a composite material (16); drilling blind holes (17) in vertical directions of the second bonding pad and the at least one first bonding pad, and processing the blind holes into metallized blind holes; and forming the metallic blind holes into a circuit closed loop or open loop by means of pattern fabrication, and obtaining a packaged triode.
Inventors:
HUANG MIAN (CN)
Application Number:
PCT/CN2017/117771
Publication Date:
June 28, 2018
Filing Date:
December 21, 2017
Export Citation:
Assignee:
SHENZHEN SIPTORY TECH CO LTD (CN)
International Classes:
H01L21/48; H01L21/331; H01L21/60; H01L23/498
Foreign References:
| CN106783632A | 2017-05-31 | |||
| CN106601699A | 2017-04-26 | |||
| CN102386105A | 2012-03-21 | |||
| CN103383921A | 2013-11-06 | |||
| CN104916597A | 2015-09-16 |
Attorney, Agent or Firm:
SHENZHEN CREATEFORTUNE IP AGENCY CO., LTD. (CN)
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