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Title:
ULTRASONIC INSPECTION APPARATUS AND ULTRASONIC INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/058292
Kind Code:
A1
Abstract:
Provided is an ultrasonic inspection apparatus in which defect detection performance can be improved, such as by lowering the minimum size of defects that can be detected, and which can carry out detection even in the case of very small defects. In order to solve the aforementioned problem, this ultrasonic inspection apparatus (Z) comprises a scanning measurement device (1) for scanning a body being inspected (E) with an ultrasonic beam (U) and carrying out measurement, and a control device (2) for controlling driving of the scanning measurement device (1). The scanning measurement device (1) is provided with a transmission probe (110) for emitting the ultrasonic beam (U), and a reception probe (121) for receiving the ultrasonic beam (U). The control device (2) is provided with a signal processing unit (250). The signal processing unit (250) is provided with a filter unit (240) for reducing at least a frequency component having the highest intensity within a reception signal of the reception probe (121). The filter unit (240) detects a skirting component other than the highest-intensity frequency component within a fundamental wave band that includes the highest-intensity frequency component.

Inventors:
SUZUKI MUTSUMI (JP)
KOURAI YUUSUKE (JP)
OHNO SHIGERU (JP)
Application Number:
PCT/JP2022/027599
Publication Date:
April 13, 2023
Filing Date:
July 13, 2022
Export Citation:
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Assignee:
HITACHI POWER SOLUTIONS CO LTD (JP)
International Classes:
G01N29/42; G01N29/04; G01N29/24
Domestic Patent References:
WO2021039640A12021-03-04
Foreign References:
JPH07190995A1995-07-28
JP2018004296A2018-01-11
JPH06242086A1994-09-02
JPH0894588A1996-04-12
JPS61138160A1986-06-25
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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