Title:
ULTRASONIC PROBE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/176233
Kind Code:
A1
Abstract:
According to the present invention, a second laminate comprises a flexible wiring sheet and a laminated element array supported thereby. A ground film is bonded to a living body side of the laminated element array, thereby forming a structurally-reinforced third laminate. Then, the third laminate is subjected to bending deformation to produce a bent laminate. In the course of the bending deformation, multiple elongated portions spontaneously arise in the ground film in such a manner as to be aligned in a θ-direction of the ground film.
Inventors:
IWASHITA TAKAYUKI (JP)
FUJII TAKASHI (JP)
YOSHIMURA KAZUHO (JP)
WATANABE TORU (JP)
FUJII TAKASHI (JP)
YOSHIMURA KAZUHO (JP)
WATANABE TORU (JP)
Application Number:
PCT/JP2018/047884
Publication Date:
September 19, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
A61B8/14; H04R17/00
Domestic Patent References:
| WO2016175050A1 | 2016-11-03 |
Foreign References:
| JP2002186617A | 2002-07-02 | |||
| JPH10136491A | 1998-05-22 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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