ULTRASONIC PROCESSING DEVICE

WIPO Patent Application WO/2021/246126

A1

Provided is an ultrasonic processing device having exceptional processing precision due to prevention of unnecessary fusion of workpieces by a punching tool immediately after completion of processing.　The present invention comprises an ultrasonic oscillation element 10 in which a piezoelectric element 11 is incorporated, and an oscillator 20 that supplies electric power to the piezoelectric element 11 and causes the ultrasonic oscillation element 10 to resonate. A punching tool 13 for punching out a workpiece by means of ultrasonic oscillation is attached to the distal end of the ultrasonic oscillation element 10. The oscillator 20 has an oscillation element control unit 21 that controls the amplitude of the ultrasonic oscillation element 10. The oscillation element control unit 21 has a switching time determination unit 21b that acquires a load applied to the punching tool 13 during punching of the workpiece and that determines, on the basis of the load data, carries out a determination for switching the ultrasonic oscillation element 10 from an oscillating state when processing is being performed to a stopped state when processing is not being performed.

SUZUKI JUN (JP)
KAWANABE HIDEHIRO (JP)

PCT/JP2021/018232

December 09, 2021

May 13, 2021

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SONOTEC CO LTD (JP)

B26D7/08; B26F1/00; B26F1/02

JPH1128421A	1999-02-02
JP2017087363A	2017-05-25
JP2010207971A	2010-09-24
JPH0691496A	1994-04-05
JPH02152756A	1990-06-12
JPH02311252A	1990-12-26

TAKAKI Yutaka et al. (JP)

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