Title:
UNDERFILL MATERIAL, UNDERFILL FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/212215
Kind Code:
A1
Abstract:
[Problem] To provide an underfill material that enables low-pressure packaging and voidless packaging, and a method for manufacturing a semiconductor device using the same. [Solution] Provided is an underfill material comprising a main composition that contains: an acrylic polymer; an acrylic monomer; and a maleimide compound. The acrylic polymer is contained within a range of 10-60 parts by mass in 100 parts by mass of the main composition, and the maleimide compound is contained within a range of 20-70 parts by mass in 100 parts by mass of the main composition. The present invention enables low-pressure packaging and voidless packaging.
Inventors:
MOTOMURA DAISUKE (JP)
Application Number:
PCT/JP2018/018864
Publication Date:
November 22, 2018
Filing Date:
May 16, 2018
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L21/60; C09D4/02; C09D133/00; C09D133/16; H01L21/56
Domestic Patent References:
| WO2016152271A1 | 2016-09-29 |
Foreign References:
| JP2015503220A | 2015-01-29 | |||
| JP2016146412A | 2016-08-12 |
Attorney, Agent or Firm:
ISHIJIMA, Shigeo et al. (JP)
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