Title:
UV CURING METHOD AND CURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/115383
Kind Code:
A1
Abstract:
A UV curing method and curing device. In the curing method, a surfactant of a first mass is added into a liquid medium and is stirred and dispersed, a photoinitiator of a second mass is added into the liquid medium and is stirred and dispersed, a cured matter cured by air is immersed in the liquid medium, ultraviolet irradiation is performed on the cured matter wrapped and immersed in the liquid medium, and the cured matter is taken out after a predetermined moment. The curing method can overcome the problems of insufficient oxygen inhibition and limited field of use in the prior art. The problem of surface cracking caused by water surface tension can be reduced by adding the surfactant and the initiator into the liquid medium, and the photoinitiator is added such that the surface of an irradiated matter is secondarily cured, thereby achieving complete curing; moreover, the method can be applied to the field of 3D printing.
Inventors:
MA BIAO (CN)
GE MINGTAI (CN)
WANG MANGMANG (CN)
GE MINGTAI (CN)
WANG MANGMANG (CN)
Application Number:
PCT/CN2021/140420
Publication Date:
June 29, 2023
Filing Date:
December 22, 2021
Export Citation:
Assignee:
SHANGHAI RESHI HIGH TECH MAT CO LTD (CN)
International Classes:
B29C64/379; B29C71/00; B29C71/04; B33Y40/20
Domestic Patent References:
| WO2020232662A1 | 2020-11-26 |
Foreign References:
| CN113692346A | 2021-11-23 | |||
| CN112318871A | 2021-02-05 | |||
| CN113045715A | 2021-06-29 | |||
| JP2019019309A | 2019-02-07 |
Attorney, Agent or Firm:
BEIJING IP EX-EX LAW FIRM (CN)
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