Title:
VAPOR CHAMBER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/036886
Kind Code:
A1
Abstract:
The embodiments of the present application relate to the technical field of heat dissipation. Provided are a vapor chamber and an electronic device. When the thickness of the vapor chamber is less than or equal to 0.3 mm, the thermal conductivity and temperature uniformity are good. The vapor chamber is divided into a heat source section and a condensation section. The vapor chamber comprises: a shell, a capillary structure, a heat dissipation working medium, and a plurality of support structures, wherein the plurality of support structures form a plurality of support structure columns arranged in a first direction, and each support structure column comprises a plurality of support structures arranged in a second direction, the second direction being a direction from the heat source section to the condensation section, and the first direction being perpendicular to the second direction; and a steam channel is formed between every two adjacent support structure columns; the steam channels comprise at least one first steam channel and at least one second steam channel, and the width of the first steam channel is greater than that of the second steam channel.
Inventors:
WU ZHAOHONG (CN)
Application Number:
PCT/CN2023/073637
Publication Date:
February 22, 2024
Filing Date:
January 29, 2023
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H05K7/20
Domestic Patent References:
| WO2022168801A1 | 2022-08-11 |
Foreign References:
| CN111163621A | 2020-05-15 | |||
| JP2019066175A | 2019-04-25 | |||
| JP2002372338A | 2002-12-26 | |||
| CN111380389A | 2020-07-07 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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