Title:
WAFER CASSETTE
Document Type and Number:
WIPO Patent Application WO/2004/008524
Kind Code:
A1
Abstract:
A wafer cassette includes a plate (13) for supporting a semiconductor wafer contained, a top plate (11) arranged above the plate (13), a bottom plate (12) arranged below the plate (13), and a rod (14) thrusting the plate (13) and reaching from the top plate (11) to the bottom plate (12). The plate (13) is configured so as to support the entire surface of the semiconductor wafer. Even a thin semiconductor wafer or a semiconductor wafer divided by tip-dicing can be safely and surely supported and contained. Accordingly, a semiconductor wafer or a semiconductor chip is not damaged during processing or convey.
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Inventors:
MIZOMOTO YASUTAKA (JP)
NAKAGAWA MASAYUKI (JP)
NAKAGAWA MASAYUKI (JP)
Application Number:
PCT/JP2003/007556
Publication Date:
January 22, 2004
Filing Date:
June 13, 2003
Export Citation:
Assignee:
DISCO CORP (JP)
MIZOMOTO YASUTAKA (JP)
NAKAGAWA MASAYUKI (JP)
MIZOMOTO YASUTAKA (JP)
NAKAGAWA MASAYUKI (JP)
International Classes:
B65D85/86; H01L21/673; (IPC1-7): H01L21/68; B65D85/86
Foreign References:
| JPS61132398U | 1986-08-18 | |||
| JPH0645332U | 1994-06-14 | |||
| JPH0982791A | 1997-03-28 | |||
| JPS62208884A | 1987-09-14 | |||
| JPS6199493U | 1986-06-25 | |||
| JPH0936219A | 1997-02-07 | |||
| JP2000277603A | 2000-10-06 |
Attorney, Agent or Firm:
Sasaki, Isao (KAWAMURA & ASSOCIATES Toranomon Sangyo
Bldg. 6F, 2-29, Toranomon 1-chom, Minato-ku Tokyo, JP)
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