WAFER CLEANING APPARATUS AND WAFER CHUCK THEREOF, AND WAFER CLEANING METHOD

WIPO Patent Application WO/2023/011435

A1

Provided in the present invention are a wafer chuck in a semiconductor cleaning apparatus. The wafer chuck comprises a chuck base, and a gas jet assembly and a plurality of wafer lifting shafts arranged on the chuck base, wherein the chuck base has a bearing surface for bearing a wafer, and a gas outlet of the gas jet assembly is located at a central region of the bearing surface to jet gas between the bearing surface and the wafer; and the plurality of wafer lifting shafts are distributed around the periphery of the gas outlet of the gas jet assembly along a circumferential direction of the bearing surface, each wafer lifting shaft is movable relative to the chuck base, each wafer lifting shaft is provided with a ramp, the ramp has an inclined extension surface, and the inclined extension surface is configured to bear the edge of the wafer and is configured to move the wafer to different height positions along the inclined extension surface when the wafer lifting shaft moves relative to the chuck base. In the present invention, it is possible to accurately position the height of the wafer, thereby improving the wafer cleaning efficiency. Further provided in the present invention are a wafer cleaning apparatus and a wafer cleaning method.

ZHAO HONGYU (CN)
LI AIBING (CN)
WANG RUITING (CN)

PCT/CN2022/109581

February 09, 2023

August 02, 2022

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BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)

H01L21/687; B08B3/02; B08B5/02; H01L21/02; H01L21/67; H01L21/68

CN104576495A	2015-04-29
JP2005243812A	2005-09-08
JP2012156422A	2012-08-16
JP2015222754A	2015-12-10
JPH11186367A	1999-07-09

TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)

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