Title:
WAFER FIXING TAPE, PROCESSING METHOD FOR SEMICONDUCTOR WAFER, AND SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2016/148024
Kind Code:
A1
Abstract:
Provided are: a wafer fixing tape comprising an adhesive layer on a substrate film, said substrate film including an ionomer resin obtained by crosslinking a terpolymer with a metal ion, wherein the surface of the substrate film on the opposite side to an adhesive layer 5b has an arithmetic mean roughness Ra of 0.1-3.0 μm; a processing method for a semiconductor wafer; and a semiconductor chip.
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Inventors:
OKA YOSHIFUMI (JP)
AOYAMA MASAMI (JP)
AOYAMA MASAMI (JP)
Application Number:
PCT/JP2016/057614
Publication Date:
September 22, 2016
Filing Date:
March 10, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/22
Domestic Patent References:
| WO2014200071A1 | 2014-12-18 |
Foreign References:
| JP2007005436A | 2007-01-11 | |||
| JP2012033889A | 2012-02-16 | |||
| JP2011204932A | 2011-10-13 | |||
| JP2002373871A | 2002-12-26 | |||
| JP2006295067A | 2006-10-26 | |||
| JP2008193034A | 2008-08-21 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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