Title:
WAFER HANDLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/065862
Kind Code:
A1
Abstract:
The present application relates to a wafer handling device, comprising a cylinder assembly and a cover assembly. The cylinder assembly comprises a cylinder block, and a lifting rod, which is movably connected to the cylinder block in a longitudinal direction. The cover assembly is sleeved on the cylinder assembly, and is connected to the lifting rod; and in the operation mode of the cylinder assembly, the cover assembly moves along with the lifting rod and can always cover at least the peripheral side of the joint of the lifting rod and the cylinder block. The embodiments of the present application can effectively restrain the scattering direction of particulate matter, and improve the space utilization rate of the cover assembly, so that the cover body assembly is miniaturized, thereby further improving the reliability of the wafer handling device.
Inventors:
LI LIANCHAO (CN)
LIN XIAOHUI (CN)
ZHAO SEN (CN)
LIN XIAOHUI (CN)
ZHAO SEN (CN)
Application Number:
PCT/CN2022/123911
Publication Date:
April 04, 2024
Filing Date:
October 08, 2022
Export Citation:
Assignee:
TAIWAN SEMICONDUCTOR MFG CO LTD (CN)
TSMC CHINA COMPANY LTD (CN)
TSMC CHINA COMPANY LTD (CN)
International Classes:
H01L21/677
Foreign References:
| KR20060108317A | 2006-10-17 | |||
| CN216043270U | 2022-03-15 | |||
| JP2000150445A | 2000-05-30 | |||
| JP2007073746A | 2007-03-22 | |||
| JPH09148240A | 1997-06-06 |
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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