WAFER POLISHING APPARATUS AND WAFER POLISHING METHOD USING SAME

Title:

WAFER POLISHING APPARATUS AND WAFER POLISHING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/114458

Kind Code:

A1

Abstract:

An embodiment comprises: a lower plate; an upper plate which is disposed on the lower plate and rotates; a carrier which receives a wafer and is disposed on the lower plate; and a sensor unit for irradiating light to the wafer received in the carrier, detecting light reflected by the wafer, and outputting detection data according to the detection result, wherein the sensor unit rotates together with the upper plate.

Inventors:

PARK WOO SHIK (KR)

Application Number:

PCT/KR2015/006129

Publication Date:

July 21, 2016

Filing Date:

June 17, 2015

Export Citation:

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Assignee:

LG SILTRON INC (KR)

International Classes:

H01L21/304; H01L21/02; H01L21/321

Foreign References:

JP2002059364A	2002-02-26
JPH10202514A	1998-08-04
KR20090108263A	2009-10-15
JP2010030019A	2010-02-12

Attorney, Agent or Firm:

PARK, Young Bok et al. (KR)
박영복 (KR)

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