Title:
WATER-SOLUBLE FILM AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/004346
Kind Code:
A1
Abstract:
[Problem] To provide: a water-soluble film with which hole opening can be suppressed when a package is obtained while maintaining water solubility; and a package using such a water-soluble film. [Solution] This water-soluble film contains a polyvinyl alcohol resin, wherein each side of the region of a square A2 with one side of 5 μm is divided into 64 parts in the range of a square A1 with one side, which is positioned at an arbitrary place on at least one surface of said water-soluble film, of 1-5 cm, so that the whole region is divided into 4,096 pixels, and when the elastic moduli of the pixels are measured with an atomic force microscope, the number mean value of the elastic moduli of the pixels is 1-200 MPa, and the variation coefficient of the elastic moduli of the pixels is 0.1-0.7.
Inventors:
OKAMOTO MINORU (JP)
SHIMIZU SAYAKA (JP)
KAZETO OSAMU (JP)
SHIMIZU SAYAKA (JP)
KAZETO OSAMU (JP)
Application Number:
PCT/JP2021/022540
Publication Date:
January 06, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B65D65/46; C08J5/18
Domestic Patent References:
| WO2018061272A1 | 2018-04-05 | |||
| WO2019044751A1 | 2019-03-07 | |||
| WO2018008736A1 | 2018-01-11 | |||
| WO2020138443A1 | 2020-07-02 |
Foreign References:
| JP2017052841A | 2017-03-16 | |||
| KR100590311B1 | 2006-06-19 | |||
| JP2019014109A | 2019-01-31 |
Attorney, Agent or Firm:
KOMAI Shinji et al. (JP)
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