Title:
WEARABLE ELECTRONIC DEVICE COMPRISING DAMPING STRUCTURE OF CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/025197
Kind Code:
A1
Abstract:
This wearable electronic device may comprise: a bracket; a printed circuit board at least partially facing a first surface of the bracket; an acoustic sensor structure arranged on a second surface of the bracket; a biometric sensor structure overlapping with the first surface of the bracket on the basis of the direction perpendicular to the printed circuit board; and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure can elastically support the biometric sensor structure and the printed circuit board.
Inventors:
JANG DONGHEON (KR)
KANG JUNGHYUN (KR)
KIM TAEGYUN (KR)
LEE SANGHWA (KR)
HONG SEONGHO (KR)
PARK CHUNGSOON (KR)
KANG JUNGHYUN (KR)
KIM TAEGYUN (KR)
LEE SANGHWA (KR)
HONG SEONGHO (KR)
PARK CHUNGSOON (KR)
Application Number:
PCT/KR2023/009589
Publication Date:
February 01, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G04G17/04; A61B5/00; F16F15/04; G04G17/06; G04G17/08; G04G21/02; G04G99/00; G06F1/16; H05K7/14
Foreign References:
| KR20220099365A | 2022-07-13 | |||
| KR20200120407A | 2020-10-21 | |||
| KR20220017192A | 2022-02-11 | |||
| KR20190115159A | 2019-10-11 | |||
| US20220187869A1 | 2022-06-16 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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