Title:
WELDING FILM AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2022/172863
Kind Code:
A1
Abstract:
A welding film comprising a phenoxy resin, wherein the Z‐average molecular weight of the phenoxy resin is 70,000 or more, and the ratio [Mz/Mn] of the Z‐average molecular weight with respect to the number average molecular weight of the phenoxy resin is 5.0 or more.
Inventors:
NIIBAYASHI RYOTA (JP)
TAKAHASHI NOBUYUKI (JP)
SAITO HAYATO (JP)
KUROKI KUNIHIRO (JP)
TAKAHASHI NOBUYUKI (JP)
SAITO HAYATO (JP)
KUROKI KUNIHIRO (JP)
Application Number:
PCT/JP2022/004352
Publication Date:
August 18, 2022
Filing Date:
February 04, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B32B27/00; B29C65/02; B29C65/08; B29C65/20; B29C65/32; B32B7/12; C08J5/18; C09J7/10; C09J7/35; C09J171/10
Foreign References:
| JP2020125471A | 2020-08-20 | |||
| JP2020100728A | 2020-07-02 | |||
| JP2019147863A | 2019-09-05 | |||
| JP2017171802A | 2017-09-28 | |||
| JP2017119779A | 2017-07-06 | |||
| JP2010126694A | 2010-06-10 | |||
| JP2007277333A | 2007-10-25 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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