Title:
WIRE BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/029174
Kind Code:
A1
Abstract:
This wire bonding device (100), which is provided with an ultrasonic horn (10) and a bonding arm (20), includes: a wire clamper (30) that has a clamp arm (31) that longitudinally protrudes from the tip of the bonding arm (20) and holds a wire (45), and a base body part (32) that is attached on the upper side of the bonding arm (20) and accommodates an actuator (34) for opening/closing the clamp arm (31); and a control unit (60) that adjusts the opening/closing operation of the actuator (34) of the wire clamper (30), wherein the control unit (60) vibrates the clamp arm (31), while being in an open state, in the opening/closing direction by means of the actuator (34) of the wire clamper (30) during bonding.
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Inventors:
TOYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2020/027307
Publication Date:
February 18, 2021
Filing Date:
July 14, 2020
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L21/607
Domestic Patent References:
| WO2017217385A1 | 2017-12-21 |
Foreign References:
| JP2011049498A | 2011-03-10 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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