Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WIRING BOARD AND CIRCUIT STRUCTURE OBTAINED USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/071007
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure includes a first insulating layer, which has a first surface, a land conductor located on the first surface, a second insulating layer, which covers the first surface and the land conductor and has a second surface on the reverse side from the first insulating layer, a via hole piercing from the second surface of the second insulating layer to the land conductor, and a via-hole conductor which is located inside the via hole and is in contact with the land conductor. The via-hole conductor comprises a base metal layer located on the surface of the land conductor, on the wall surface of the via hole, and at the second surface and an electroplating layer located on the base metal layer. At least some of the base metal layer has a plurality of voids therein.

Inventors:
YUGAWA HIDETOSHI (JP)
Application Number:
PCT/JP2023/034644
Publication Date:
April 04, 2024
Filing Date:
September 25, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/46; H01L23/12; H05K3/42
Foreign References:
JP2008192938A2008-08-21
JPH05251849A1993-09-28
JP2008050673A2008-03-06
JP2016105449A2016-06-09
JP2005146328A2005-06-09
JP2004158703A2004-06-03
JPH09326547A1997-12-16
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM

Next Patent: METHOD FOR ISOLATING ANTIGEN MOLECULE