WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

Title:

WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2019/188843

Kind Code:

A1

Abstract:

Disclosed is a wiring board. The wiring board has a board including a first element, a diffusion layer that is in contact with the board and includes a first metal element, and a first metal film that is in contact with the diffusion layer and includes a second metal element. The diffusion layer has a region including at least the first element and the first metal element, and a region including the first metal element and the second metal element. The concentration of the second metal element in the diffusion layer may decrease as the substrate is approached in the thickness direction. The concentration of the first element in the diffusion layer may decrease as the first metal film is approached in the thickness direction.

Inventors:

FURUSHOU HIROKI (JP)
CHIGIRA ATSUKO (JP)
SASAO TOSHIO (JP)
MAWATARI HIROSHI (JP)

Application Number:

PCT/JP2019/012249

Publication Date:

October 03, 2019

Filing Date:

March 22, 2019

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD (JP)

International Classes:

C23C18/18; B32B15/04; C23C28/00; C25D5/54; H05K3/38

Foreign References:

JP2008282887A	2008-11-20
JP2008166742A	2008-07-17
JP2005158887A	2005-06-16
JP2013125655A	2013-06-24
JP2012027159A	2012-02-09