Title:
WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/157502
Kind Code:
A1
Abstract:
Provided is a rewiring board comprising a metal support which incudes a top surface and a bottom surface and includes a via hole. The outer surface of the metal support is covered by a coating layer. A conductor layer is formed on the top surface and the bottom surface of the metal support and an inner peripheral surface of the via hole through the coating layer. In a cross section of the metal support passing through the opening of the via hole, a contour line representing the inner peripheral surface of the via holes is curved. The via hole is formed such that the contour line of the inner peripheral surface conforms to a predetermined condition.
Inventors:
KUWAYAMA HIRONORI (JP)
ISHII JUN (JP)
OYABU YASUNARI (JP)
KAMAKURA MASAKI (JP)
HODONO MASAYUKI (JP)
JURO NAOSHI (JP)
ASO TOMOKI (JP)
ISHII JUN (JP)
OYABU YASUNARI (JP)
KAMAKURA MASAKI (JP)
HODONO MASAYUKI (JP)
JURO NAOSHI (JP)
ASO TOMOKI (JP)
Application Number:
PCT/JP2022/048683
Publication Date:
August 24, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/05; H05K1/02; H05K1/11; H05K3/40
Domestic Patent References:
| WO2008069260A1 | 2008-06-12 |
Foreign References:
| JP2008028376A | 2008-02-07 | |||
| JP2006100631A | 2006-04-13 | |||
| JPH10135593A | 1998-05-22 | |||
| JP2013127122A | 2013-06-27 | |||
| JP2004179291A | 2004-06-24 | |||
| US20140048319A1 | 2014-02-20 | |||
| JP2016127275A | 2016-07-11 | |||
| JP2017073532A | 2017-04-13 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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