WIRING MODULE

WIPO Patent Application WO/2022/176609

A1

Provided is a wiring module 20 comprising a flexible printed wiring board 21 that is electrically connected to a plurality of power storage elements 11. The flexible printed wiring board 21 comprises: a base film 24 that has insulative properties, and that has a first surface and a second surface; an adhesive layer 32 that has adhesive properties, and that is layered on the first surface of the base film 24; a conductive path 25 that is layered, via the adhesive layer 32, on the first surface of the base film 24; and a coverlay 26 that is layered, via the adhesive layer 32, on the first surface of the base film 24 so as to cover the first surface of the base film 24 and the conductive path 25. The conductive path 25 has a fuse part 27 that constitutes a portion of a circuit, and that has a smaller cross-section area than the other portions. A resin part 37 comprising an insulative synthetic resin is formed in a portion of the second surface of the base film 24 corresponding to the fuse part 27, and in a portion of an upper surface of the coverlay 26 corresponding to the fuse part 27.

JPH11185595	BONDING METHOD FOR CYLINDRICAL FUSE LINK
JP5283522	Temperature sensitive material and its manufacturing method, thermal fuse, circuit protection element
JP2009540522	Surface mount type small fuse and its manufacturing method

YOSHIDA SHINICHIRO (JP)
NAKAYAMA OSAMU (JP)
TAKADA KOTARO (JP)

PCT/JP2022/003928

August 25, 2022

February 02, 2022

Click for automatic bibliography generation  

AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

H01H69/02; B60R16/02; H01H85/10; H05K1/02; H05K1/16

WO2020184564A1

2020-09-17

JP2017011253A	2017-01-12
JP2017011191A	2017-01-12

AKATSUKI UNION PATENT FIRM (JP)

View/Download PDF      PDF Help

Previous Patent: CATIONIC CURING AGENT, METHOD FOR PRODUCING SAME AND CATIONICALLY CURABLE COMPOSITION

Next Patent: MAP DISPLAY SYSTEM