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Patent Searching and Data


Title:
WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/176395
Kind Code:
A1
Abstract:
A wiring module 20 to be attached to a plurality of electricity storage elements 11 comprises a bus bar 21 to be connected to electrode terminals 12A, 12B of the plurality of electricity storage elements 11, a flexible substrate 30, a metal piece 22 connecting the bus bar 21 and the flexible substrate 30 together, and an electric cable 23, wherein: an electrically conductive path 39 comprising a first land 41 connected to the metal piece 22, a second land 42 connected to the electric cable 32, and a fuse portion 43 provided between the first land 41 and the second land 42 is formed on the flexible substrate 30; and the flexible substrate 30 comprises a substrate main body 31, and a coupling portion 33 for coupling the substrate main body 31 and the metal piece 22 together while permitting displacement of the metal piece 22 relative to the substrate main body 31.

Inventors:
IKEDA SHUYA (JP)
NAKAYAMA OSAMU (JP)
IKEDA RYOTA (JP)
Application Number:
PCT/JP2023/007003
Publication Date:
September 21, 2023
Filing Date:
February 27, 2023
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01M50/519; H01G11/10; H01M50/209; H01M50/284; H01M50/298; H01M50/503; H01M50/583
Foreign References:
JP2021096926A2021-06-24
JP2018147651A2018-09-20
JP2020087665A2020-06-04
US20200236779A12020-07-23
CN209964376U2020-01-17
CN210379247U2020-04-21
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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