Title:
WORKPIECE HEIGHT MEASUREMENT DEVICE, AND MOUNTING SUBSTRATE INSPECTION DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/032095
Kind Code:
A1
Abstract:
This workpiece height measurement device comprises an imaging unit for capturing an image of a workpiece, a line light projection unit which has a projection optical axis at a prescribed angle of intersection with an imaging optical axis and is capable of radiating line light from a plurality of directions to the workpiece, a scan drive unit for causing the imaging unit and the line light projection unit to move to perform scanning of the workpiece, and a measurement unit for determining height data of the workpiece by an optical cutting method on the basis of images acquired by the scanning. The measurement unit causes the line light to be radiated to the workpiece from a prescribed irradiation direction to perform a first scan, determines whether there is a missing part in the workpiece height data, in the height data obtained on the basis of an image acquired by the first scan, and causes a second scan to be performed in which the irradiation direction of the line light is different from that of the first scan when a missing part is detected.
Inventors:
ARAI TAKESHI (JP)
MATSUKUBO TAKAHIRO (JP)
MATSUKUBO TAKAHIRO (JP)
Application Number:
PCT/JP2021/032173
Publication Date:
March 09, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
G01B11/24
Domestic Patent References:
| WO2020136885A1 | 2020-07-02 |
Foreign References:
| JPH07218231A | 1995-08-18 | |||
| JP2015078935A | 2015-04-23 | |||
| JP2012122844A | 2012-06-28 | |||
| JP2012021909A | 2012-02-02 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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