Title:
WORKPIECE SHAPE MEASUREMENT SYSTEM, WORKPIECE SHAPE MEASUREMENT METHOD, AND WORKPIECE SHAPE MEASUREMENT PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/185741
Kind Code:
A1
Abstract:
A workpiece shape measurement system (100) that comprises a displacement sensor (2), a first movement mechanism (6), and a workpiece shape measurement device (1). The displacement sensor (2) is arranged opposite the surface (91) of a workpiece (90), irradiates dotted light (L) at the surface (91) of the workpiece (90), and measures the displacement of the surface (91) of the workpiece (90) in an opposite direction (Z). The first movement mechanism (6) moves the displacement sensor (2) in a first movement direction (X) that is orthogonal to the opposite direction (Z). The workpiece shape measurement device (1) has: a first movement control unit (34a) that drives the first movement mechanism (6) and controls the position of the displacement sensor (2) relative to the workpiece (90) in the first movement direction (X); and a displacement acquisition unit (35) that successively acquires displacement measurement results from the displacement sensor (2) as the first movement control unit (34a) moves the displacement sensor (2).
Inventors:
OYAMA SATOSHI (JP)
YAMAKAWA SHINSUKE (JP)
YAMAKAWA SHINSUKE (JP)
Application Number:
PCT/JP2022/001311
Publication Date:
September 09, 2022
Filing Date:
January 17, 2022
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01B11/24; B25J13/08; G01B11/00
Foreign References:
| JP2019194571A | 2019-11-07 | |||
| JP2014098572A | 2014-05-29 | |||
| JPH02162789A | 1990-06-22 | |||
| JP2018155646A | 2018-10-04 |
Attorney, Agent or Firm:
MOTOYAMA, Masafumi (JP)
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