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WO/2022/223277A1 |
A surface treatment device for treating a surface of a substrate support, wherein the surface treatment device comprises a contacting surface that is configured to contact the surface of the substrate support. The contacting surface is c...
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WO/2022/219955A1 |
The present invention pertains to a method for manufacturing a semiconductor wafer, the method being characterized by comprising, at least, a chamfering step for polishing the circumferential edge of a wafer and forming a chamfered part ...
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WO/2022/215370A1 |
The present invention is a wafer processing method characterized by surface-grinding a front surface of a wafer and a back surface opposite the front surface, with a grindstone with a grit number of 10000 or more, and double-side polishi...
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WO/2022/216554A1 |
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...
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WO/2022/210744A1 |
[Problem] To provide a polishing composition that has a superior working force and that has good washability after polishing. [Solution] A polishing composition including: abrasive grains; water; and a hydrophobic dispersion medium. The ...
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WO/2022/210165A1 |
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing...
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WO/2022/210676A1 |
This polishing pad has a polishing layer that comprises an isocyanate-terminated prepolymer and a polyurethane resin foam derived from a curing agent, wherein: the distance between hard segments in the polishing layer as measured by smal...
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WO/2022/209389A1 |
The present invention relates to a polishing pad and a polishing device for use in polishing a substrate such as a wafer. Moreover, the present invention relates to a method of polishing a substrate such as a wafer. A polishing pad (30) ...
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WO/2022/209758A1 |
Provided is a polishing method whereby it becomes possible to reduce defects on the surface of an object to be polished. The polishing method comprises a polishing step for supplying a polishing composition S1 containing abrasive grains ...
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WO/2022/210264A1 |
This polishing pad includes: a polyurethane sheet serving as a polishing layer; and an end point detection window provided in an opening in the polyurethane sheet. In a dynamic viscoelasticity measurement of the end point detection windo...
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WO/2022/210037A1 |
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous ph...
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WO/2022/209229A1 |
Provided is a polishing composition that can polish a resin-made object to be polished at high polishing speed and that can polish the surface of the resin-made object to be polished so as to be flat and smooth. This polishing compositio...
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WO/2022/209150A1 |
[Problem] To provide a means which, when used for polishing works comprising polysilicon and silicon nitride, is effective in inhibiting both insufficient polishing and dishing. [Solution] A polishing composition which comprises abrasive...
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WO/2022/203881A1 |
Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The up...
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WO/2022/203781A1 |
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...
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WO/2022/202688A1 |
The present invention provides a means for reducing surface defects in a substrate after the polishing of the substrate. The present invention relates to a method for polishing a substrate, the method comprising a polishing step, in whic...
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WO/2022/201254A1 |
This polishing pad comprises a polyurethane sheet as a polishing layer, the polyurethane sheet being such that the ratio (E'B40/E'T40) of the 40°C storage elastic modulus E'B40 in a dynamic viscoelasticity measurement performed under be...
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WO/2022/202059A1 |
Provided is a method for manufacturing a polishing pad that comprises a polishing layer having an endpoint detection window, the method including: a curing step for fixing an endpoint detection window member inside of a die, and curing a...
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WO/2022/202008A1 |
The present invention can prevent a decrease in the accuracy of stopping point detection in which a window for stopping point detection is used, while also suppressing influence on polishing performance. A polishing pad 3 comprises a w...
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WO/2022/197347A1 |
A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is pos...
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WO/2022/196631A1 |
Provided are a polishing head and a polishing treatment device with which uneven polishing of a substrate surface being polished, such as partial insufficient polishing or over-polishing, is prevented, with which a further improvement in...
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WO/2022/197132A1 |
A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped...
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WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
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WO/2022/190771A1 |
The present invention pertains to managing a polishing device for polishing wafers, and in particular, pertains to a technique for measuring a physical quantity on the surface of a wafer being polished by the polishing device. The polish...
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WO/2022/187074A1 |
A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The chemical mechanical polishing sy...
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WO/2022/187146A1 |
Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. Fo...
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WO/2022/187105A1 |
Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrat...
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WO/2022/186993A1 |
During polishing of a substrate a sequence of measured values is received from an in-situ motor torque monitoring system. Positions on the substrate of the region of lower coefficient of friction are calculated for at least two measured ...
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WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
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WO/2022/187249A1 |
A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to f...
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WO/2022/186992A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so ...
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WO/2022/187025A1 |
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first mod...
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WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
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WO/2022/187057A1 |
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camer...
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WO/2022/185793A1 |
Provided is a means for being able to reduce the abrasive grain residue on the surface of an object to be polished after polishing. The polishing composition of the present invention is a polishing composition including abrasive grains a...
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WO/2022/187055A1 |
A method for optimizing polishing includes, for each respective retaining ring of a plurality of retaining rings mounted on a particular carrier head, performing measurements for a bottom surface of the respective retaining ring mounted ...
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WO/2022/186988A1 |
Method of training a neural network for spectrographic monitoring includes polishing a test substrate, measuring by an in-situ spectrographic monitoring system a sequence of test spectra of light reflected from the substrate and measurin...
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WO/2022/182881A1 |
Containment and exhaust systems for substrate polishing components are disclosed. In one aspect, a substrate carrier head, includes a polishing pad, a substrate carrier head configured to retain a wafer against the polishing pad, an atom...
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WO/2022/181787A1 |
Provided is a polishing pad which has a high tracking performance even if a surface to be polished is a curved surface. A polishing pad (1) according to an embodiment of the present invention is provided with a polishing layer (2) having...
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WO/2022/182513A1 |
A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially ...
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WO/2022/181019A1 |
The present invention provides an apparatus for double-side polishing of a semiconductor wafer using a polishing cloth and a polishing slurry, said double-side polishing apparatus being characterized in that: a dressing apparatus to whic...
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WO/2022/176983A1 |
This fluid polishing device comprises a shaft body, a main magnetic material, a sub magnetic material, and an electric field path. The main magnetic material includes a conductive layer formed partially or entirely in a cylindrical magne...
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WO/2022/176576A1 |
A processing condition setting device 20 is provided with a control unit 22 for selecting a parameter set to be applied to a wafer processing device 1 from among a plurality of parameter sets. On the basis of a pre-processing characteris...
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WO/2022/177726A1 |
A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housi...
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WO/2022/172438A1 |
Provided is an abrasive agent for tungsten materials, the abrasive agent comprising abrasive grains, an ammonium salt, an iron-containing compound and an oxidizing agent, in which the abrasive grains have a positive zeta potential and th...
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WO/2022/173581A1 |
Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical ...
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WO/2022/168860A1 |
The present invention provides a polishing composition which contains abrasive grains, a permanganate salt, an aluminum salt and water. With respect to this polishing composition, the concentration W1 (% by weight) of the abrasive grains...
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WO/2022/166776A1 |
A flexible membrane for chemical mechanical planarization, the flexible membrane comprising a bottom plate part (141) for receiving a substrate; an annular edge side wall, the edge side wall being provided with an upright part (142), whi...
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WO/2022/166777A1 |
A chemical mechanical planarization control method, comprising: planarizing a wafer (w) by using a carrier head (30) having a plurality of pressure chambers (C1, C2, C3, C4, C5), wherein the pressure chambers correspondingly divide the s...
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WO/2022/168858A1 |
The present invention provides a polishing composition which is capable of suppressing an increase in the temperature of a polishing pad during polishing. A polishing composition according to the present invention contains: water; an oxi...
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