Document |
Document Title |
JP5870658B2 |
|
JP5873020B2 |
A method for recycling waste water containing slurry from a semiconductor treatment process; including: Filtration in which waste water containing the fresh slurry is continuously introduced into a circulation tank, during which time the...
|
JP5872836B2 |
|
JP5860026B2 |
It is an object of the invention of the present application to provide a recycle system capable of efficiently recovering a coolant recovery liquid, recovery abrasive grain, and recovery cutting powder which have high purity without gene...
|
JP5860122B1 |
To provide a slurry supply device capable of preventing contamination of a slurry and a polishing device including the slurry supply device. A slurry supply device 100A has a slurry supply unit 120 for ejecting a slurry S, a slurry suppl...
|
JP5858050B2 |
The problem addressed by the present invention is to provide: an abrasive material regeneration method that, by means of an efficient method, recovers cerium oxide from used abrasive material having cerium oxide as the primary component,...
|
JP5850192B1 |
To provide a method for recovering an abrasive capable of recovering a high-purity abrasive from a recovery slurry containing a used abrasive by a simple method. The method for recovering an abrasive of the present invention is a method ...
|
JP5843036B1 |
To provide a method for recovering an abrasive capable of recovering a high-purity abrasive from a recovery slurry containing a used abrasive by a simple method. In the method for recovering an abrasive of the present invention, an abras...
|
JP2015231644A |
To provide a sludge recovery device capable of efficiently separating-removing sludge, by taking out a mixed fluid recovered in a tank to the outside of the tank from a required position of a bottom wall, by avoiding deposition of the sl...
|
JPWO2013153880A1 |
A method for polishing a glass substrate by supplying a polishing liquid between the glass substrate and the polishing pad, wherein the polishing liquid is a cerium oxide slurry, and the polishing liquid is between the glass substrate an...
|
JP5819515B2 |
|
JP2015199134A |
To provide a polishing device and a polishing method capable of preventing polishing failure due to concentration fluctuation of slurry.A polishing device for polishing a plate-like object includes retention means which retains the plate...
|
JP5808690B2 |
To provide a liquid purifying device capable of reducing an installation area, and eliminating removal work and cleaning work of sludge.A liquid purifying device includes: a first tank 1 for storing a liquid containing sludge; a second t...
|
JP2015193054A |
To provide a miniaturized gas-liquid separator for a substrate treatment device with a plurality of polishing units and the substrate treatment device equipped with the gas-liquid separator.A gas-liquid separator 300 is provided with a h...
|
JP5803601B2 |
|
JP2015188831A |
To provide a liquid purification system capable of treating sludge in a drainage/solidification device even if the sludge collection amount of a sludge collection device becomes large and capable of improving the treatment efficiency of ...
|
JP5802609B2 |
|
JP5802251B2 |
Provided is a magnetic filter device for preventing the reduction in magnetic field strength at positions at a distance from the magnet unit. The magnetic filter device (1A, 1B) is provided with: a processing vessel (6) having a processi...
|
JP2015182179A |
To provide a slurry feeder capable of stably feeding slurry liquid.The slurry feeder comprises: a storage tank that stores slurry liquid including oxide particles; feeding piping 13 leading from the storage tank to processing device; a r...
|
JP5795977B2 |
|
JP5775381B2 |
|
JP2015525138A |
The present invention relates to an apparatus and method for separating grinding oil from grinding sludge. The device comprises a stirrer (1) having a stirrer (3), which can be moved up and down within the stirrer. Further, the grinding ...
|
JP5771551B2 |
|
JP5772243B2 |
|
JP2015155132A |
A with a simple apparatus configuration, the abrasive containers from a mixed material containing processing refuse and abrasive to provide a method of separating the easy. A separation method for separating processing waste and polishin...
|
JP5768650B2 |
|
JP2015150658A |
To provide a method and an apparatus for producing a glass polishing material by regenerating a polishing material with high purity from a slurry including a used glass polishing material.In a method for producing a glass polishing mater...
|
JP5760403B2 |
|
JP5758655B2 |
|
JP5756423B2 |
|
JP2015127363A |
To provide a cutting fluid composition for a fixed abrasive grain wire saw, which exhibits, when cutting a silicon ingot, good dispersibility of cutting powder and permeability into a cut part.Provided is a cutting fluid composition for ...
|
JP5740255B2 |
|
JP5737486B1 |
The polishing apparatus 1 includes a processing container 10 for charging the work piece, a fluidization unit for flowing the work piece in the processing container, and an abrasive material charging unit 30 for charging the abrasive mat...
|
JP5736800B2 |
|
JP5730851B2 |
Disclosed is a filtration method that extends filter life and achieves high filtration efficiency, and also abrasive slurry produced by the method. In this filtration method, deaired solvent is passed through a filter before a non-deaire...
|
JP2015097997A |
To provide a centrifugal machine which exhibits high quality of recovery objects and high recovery efficiency, and can be automatically controlled with high precision, a management system of a polishing liquid used in the centrifugal mac...
|
JP5721245B2 |
|
JP5716612B2 |
|
JP2015089597A |
To provide a polishing device which uniformly polishes an entire surface of a polishing object while maintaining a high polishing rate.A polishing device includes: a holder which holds a polishing object; an upper surface plate 120 havin...
|
JP2015085389A |
To provide a method of reusing slurry which has little variation in the thickness of a base plate when slicing, and reduced the adhesion of abrasive grains to the base plate after slicing.A method of reusing slurry which is supplied to a...
|
JPWO2013099595A1 |
The present invention relates to an additive for an abrasive that can suppress a decrease in the polishing characteristics of the abrasive, particularly a polishing speed, by adding the abrasive to the abrasive that is repeatedly used at...
|
JP2015077682A |
To use two kinds of stock solution tanks storing stock solution with different dilution ratio from each other in a common abrasive liquid supply device.An abrasive liquid supply device 10 includes: a stock solution supply part 12 for sup...
|
JP5706336B2 |
The invention provides a method and apparatus for removing magnetic or magnetized contaminants from a wiresaw cutting slurry during a wiresaw cutting process. The apparatus comprises a recirculating slurry dispensing system that defines ...
|
JP5703133B2 |
|
JP2015066656A |
To provide a regeneration method for a used polishing agent, which can recover the polishing rate of a cerium system polishing agent used in polishing glass and suppress occurrence of a flaw on a surface of a glass substrate when the pol...
|
JPWO2013069720A1 |
An object of the present invention is to provide a method for easily recycling a polishing agent having a high removal rate of silicon component and aluminum component and having polishing performance equivalent to that of a new polishin...
|
JP5691179B2 |
|
JPWO2013054577A1 |
Provided are a processing waste liquid circulation device and a processing waste liquid circulation method capable of maintaining a pH value of a processing liquid within a predetermined range. The machining fluid is supplied to the mach...
|
JPWO2013054576A1 |
Provided are a processing waste liquid treatment apparatus and a processing waste liquid treatment method capable of maintaining the conductivity of the processing liquid within a predetermined range. The processing liquid is supplied to...
|
JPWO2013047678A1 |
Cutting or polishing provided with a fixed abrasive wire (2) to which abrasive particles are fixed, a support unit (8) for supporting a workpiece (10), and a coolant liquid supply unit (9) for supplying a coolant liquid. Using the crushe...
|