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WO/2000/001291A1 |
The specification discloses a mobile surfacing machine having a planetary head (3) and several satellite heads (6). The satellite heads are adapted to grind a surface and the planetary head is adapted to move the surfacing machine around...
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WO/1999/067054A1 |
A semi-conductor wafer (12) has its inclined edge flanks polished by a grooved wheel (16) of synthetic plastics material, while a jet (20) of polishing slurry, which may comprise colloidal silica, is fed downwards into the zone of contac...
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WO/1999/062655A1 |
A system, apparatus and method for machining (110) a rotor by determining a center plane (126) of the rotor based on two surfaces of the rotor (101, 105), preferably two interior surfaces (101, 105); positioning the rotor (106) based on ...
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WO/1999/056910A1 |
A polishing machine (10) includes a platform assembly (60) mounted within three support columns (32, 34, 36). The platform assembly (60) includes fluidically pressurized bladders (102, 104) for urging the upper polish plate (20) toward a...
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WO/1999/055491A1 |
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads (110). Then the substrate is polished with a standard polishing pad (100) to remove scratch defects created by the fixed-abrasive ...
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WO/1999/054087A2 |
A device and method to convert ordinary rotary motion of input frequency $g(V) into a composite motion with the same primary frequency $g(V) plus an eccentric motion at a higher frequency $g(v) enables a low speed rotary input to drive a...
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WO/1999/053528A2 |
A wafer finishing system and method. A polishing pad (24) is rotated about an axis parallel to a surface (10) of a semiconductor wafer (12). The polishing pad (24) is supported by a roller (22) that receives fluid (38) and distributes th...
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WO/1999/052658A1 |
The invention relates to a method and a device for removing the oxide layer from hot-rolled steel sheets. The sheet is mechanically deformed in order to break open the oxide layer. Once it has been broken open, the oxide layer is removed...
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WO/1999/051394A1 |
A working device characterized by comprising a transfer path for guiding magnet members to be ground in one direction, a transfer means for energizing a plurality of magnet members on the transfer path in the transfer direction so as to ...
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WO/1999/047305A1 |
A machine for grinding billets (2) is described and comprises a framework (3) on which the billet (2) being ground is guided along a predetermined axis (B) of movement, and at least one grinding wheel (18, 19) which is mounted on the fra...
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WO/1999/046082A1 |
The invention aims to provide a surface pattern for wide-wheel grinding devices instead of improving the surface fineness of such devices by increasingly intensive grinding measures. When on the side of a plate at least two grinding devi...
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WO/1999/046080A1 |
A method and apparatus for repairing optical discs (30), wherein the apparatus includes an improved buffing wheel (10) capable of applying a uniform buffing action across the readable surface (38) of an optical disc (30), and wherein the...
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WO/1999/044787A1 |
A planer, wherein a saddle (51) with a spindle (50) mounted thereon is brought in contact directly or indirectly with the side surfaces of three columns (10, 20, and 30) erectedly installed generally in an equilateral triangle so that th...
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WO/1999/042250A1 |
The present invention is a fixed abrasive article for grinding or polishing the surface of a glass workpiece. The abrasive article for grinding glass has abrasive composites containing a binder, an alkaline metal salt, and diamond abrasi...
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WO/1999/037444A1 |
The polishing of the granite surface is carried out by using a mobile polishing machine of the conventional type which is provided with a polishing stone comprised of abrasive material of which the hardness has been reduced by 50-80 % an...
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WO/1999/034954A1 |
A stone tile finishing system (1) includes an apparatus and a group of different tools usable in the apparatus for various tile finishing operations. The apparatus itself has a motor (21), a tool mount rotated by the motor (21) and a til...
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WO/1999/028081A1 |
A grinding machine, in particular a face grinder for grinding the faces of silicon wafers, has a grinding wheel spindle (20) and a work spindle (22) which are mounted so as to be pivotal about axes (A and B) respectively, each axis being...
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WO/1999/022905A1 |
With sanding or sanding machines with rotating sanding tools comprising sanding segments which are rotated in mutually opposite directions, according to the invention a more uniform sanding result and uniform wear on the tools is achieve...
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WO/1999/015312A1 |
A polishing machine includes a platform assembly (60) slidably mounted on three support columns (32-36). The assembly (60) includes first and second platforms (64, 66) joined together and slidably movable toward and away from each other....
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WO/1999/006181A1 |
The diamond roller for ceramics, having abrasive with sloped side, comprises the abrasive diamond material disposed on the surface of the roller (9), and it is characterised in that it presents for a brief length (10) and on one end, at ...
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WO/1999/003392A1 |
A rotating tool (1) includes a drive unit (2) comprising a rotor (12) which is driven by high pressure water exiting nozzles (19). Such a construction has the advantage that only water, and no further sources of power, need be supplied t...
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WO/1999/001255A1 |
A double face abrading machine for simultaneous removal of material from two plane-parallel surfaces of a work piece, and incorporating a first and a second tool (1, 2) forming between them a machining gap (3), the first tool (1) being a...
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WO/1999/000831A1 |
Conventional methods of manufacturing semiconductor devices are such that semiconductor devices are insufficient in flattening, great in surface step difference, and liable to cause wiring disconnections in the case of multilayer interco...
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WO/1998/053952A1 |
A tool (10) is provided for polishing, planarizing, cleaning or otherwise processing silicon wafers (16) or other workpieces. It comprises a cylindrical roller (14) mounted on a spindle (12) above a platform or workstation on which a waf...
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WO/1998/048977A1 |
Rolls (2) provided with a rubber layer are used in grinding machines (1). According to the present invention this layer consists of a number of sector-like units (9), the lower end of each unit (9) being inserted in a groove (3) in the s...
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WO/1998/047659A1 |
A grinding unit is serving for grinding for example stone floors (2). The grinding unit comprises a guidable control grinding machine (1) with a grinding disc bearing on the flow with the grinding bodies of the machine during operation, ...
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WO/1998/040191A1 |
In a grinding machine such as a surface grinder, the machine bed (10) carries for only Y axis vertical movement or adjustment a work table (12) on a movable support or knee (11) extending forwardly from the bed (10). A saddle (13) slidab...
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WO/1998/032893A2 |
A wafer support system comprising a segmented susceptor (602) having top and bottom sections and gas flow passages therethrough. A plurality of spacers or a spacer (615) projecting from a recess (604) formed in the top section (608) of t...
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WO/1998/030360A1 |
An abrasive body for grinding optical glass, precious and natural stones (marble) or other materials such as wood, metal, plastics or the like, consists of a base body (3) made of a woven, knitted or embroidered fabric made of carbon fib...
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WO/1998/030357A1 |
An abrasive body (13) for a grinding disk (11), a grinding wheel or the like for grinding optical glass, precious and natural stones (marble) or the like has a base body (16) made of a sintered hard material upon which a diamond coating ...
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WO/1998/029217A1 |
The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing...
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WO/1998/021412A1 |
A grinding machine to remove markings such as painted lines from a paved surface includes a wheeled carriage to be moved over the paved surface. A grinder is positioned beneath the carriage to contact and grind the paved surface. A suspe...
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WO/1998/019301A1 |
An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantia...
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WO/1998/017438A1 |
In a surface polishing apparatus wherein a plurality of grindstones having bolt insert holes are placed on a fixed lapping board via a base so that the working surfaces of the grindstones form the same plane, the surfaces, to which the g...
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WO/1998/014305A1 |
Methods and apparatus for measuring and controlling the flow rates of processing solutions to a CMP machine during the polishing and planarization process. The apparatus comprises a processing solution source, a processing solution dispe...
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WO/1998/013173A1 |
The present invention is related to a method used for giving the surfaces of natural stones such as marble, travertine, etc., an aged and weathered appearance. This method is realized by using wire brushes instead of abrasives being a ki...
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WO/1998/011600A1 |
A method for working a semiconductor wafer by which a highly accurate flat surface of a semiconductor wafer is formed with a high controllability by working a film formed on the uneven surface of a semiconductor wafer with a vertical wor...
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WO/1997/047434A1 |
A flexible abrasive member comprises a porous layer which carries deposits with embedded abrasive particles, said deposits being separated from each other. The deposits are arranged and shaped in such a way that they are mutually interlo...
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WO/1997/038824A1 |
A profiled, soft cushined roller (14) is provided with an outer profiled abrading surface (15) that conforms to and rides on a contoured substrate surface (21) during an abrading operation. A soft roller (14) usually in the form of a sof...
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WO/1997/037812A1 |
A device for preparing metallographic samples has its power input rated so as to allow only safe voltage power supply, not exceeding 50 V AC or 150 V DC. It can be provided with indication of instantaneous power off-take and its DC elect...
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WO/1997/029883A1 |
A method of wet-grinding a surface, particularly a floor comprised of stone or stone-like material, wherein liquid is delivered to the area of contact between a grinding tool and the grinding surface, wherein liquid-bound particulate sol...
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WO/1997/028919A1 |
An indexable cutting insert for metal machining comprises a rake surface (5), a bottom surface (6) and side surfaces (7) that extend between said two surfaces, cutting edges (10) being formed at the transitions between the side surfaces ...
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WO/1997/020658A1 |
A method of flattening projections on a sheet material having fine projections on a surface thereof, which protrude from a flat portion of the material, said method comprising partially immersing a rod member, which has a surface having ...
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WO/1997/010925A2 |
An automatic polishing machine (14) for polishing aircraft windows (12) uses pressurized air to create a suction to hold the polishing unit (20) on the aircraft (10), creates a suction to automatically pick up a polish pad (196), which i...
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WO/1997/011484A1 |
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abra...
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WO/1997/010613A1 |
A grinding method which uses grindstone comprising abrasive grains and a binding resin for binding the abrasive grains, and a grinding device for use in the same. Grindstone having a desired elastic modulus can be manufactured by means o...
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WO/1996/037340A1 |
A system for lapping transducers (28) has an abrasive surface (22) that communicates with the transducers to provide information for controlling the lapping of the transducer. The lapping body (20) communicates with a transducer (28) wit...
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WO/1996/036459A1 |
A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attache...
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WO/1996/031316A1 |
An apparatus (28) for reconditioning the protective coating (14) of a digital recording disc (10) includes a turntable (30) configured to receive the digital disc (10), a first motor (42) for rotating the turntable (30), a turntable supp...
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WO/1996/022173A1 |
The invention relates to a method for grinding of preferably billets, blooms and slabs which are moved in a certain direction on a support. The method means that the grinding is performed in a track which is perpendicular to the travel d...
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