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Patent Searching and Data


Matches 701 - 750 out of 4,699

Document Document Title
WO/2001/012689A1
A composition capable of forming a semi-interpenetrating polymer network, said composition including at least one epoxy monomer, at least one olefin monomer, forming a co-monomer mixture with the epoxy monomer; and a catalytic amount of ...  
WO/2001/007518A1
An aqueous dispersion excellent in adhesion to various substrates, storage stability, weatherability, hydrophobicity, etc. The dispersion is obtained by dispersing a block copolymer comprising a polymer block (A) consisting mainly of ole...  
WO/2001/002189A1
The invention refers to a note-pad (1) comprising a plurality of sheets of paper and a base sheet, each of said plurality of sheets of paper and the base sheet having a top face (10A, 11A), a bottom face (10B, 11B) and side edges (10C, 1...  
WO/2001/000257A1
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive contains from 5 to less than 15 percent by weight of a blend of a selectively hydrogenated block copolymer of sty...  
WO/2001/000256A1
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive contains from 6 to less than 15 percent by weight of a selectively hydrogenated block copolymer of styrene and (b...  
WO/2001/000255A1
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises:(a) from greater than 6 to less than 15 percent by weight of the total of (a), (b) and (c) of a selecti...  
WO/2000/078886A1
A water sensitive or water activated hot melt adhesive composition comprising: (a) 5 to 40 % by weight, of an A-B-A linear or radial rubbery block copolymer; (b) 20 to 70 % by weight of a compatible tackifying resin; (c) 0 to 30 % plasti...  
WO/2000/077118A1
The present invention relates to an adhesive composition comprising: (i) a block copolymer containing at least two poly(monovinyl aromatic hydrocarbon) blocks and at least one hydrogenated poly(conjugated diene) block; (ii) 20 to 80 part...  
WO/2000/075257A1
The present invention is directed to hot melt pressure sensitive adhesive compositions, that exhibit excellent adhesion properties and improved thermal stability, said compositions comprising: a) 1 to 30 parts of styrene-butadiene-styren...  
WO/2000/075226A1
A curable composition comprising (A) a block copolymer having at least one block formed from an aliphatic hydrocarbon-based compound and (B) an isobutylene-based polymer having a group containing a silicon bonded with a hydrolyzable grou...  
WO/2000/073397A1
An adhesive composition including as principal components: a) about 10-90 % by weight of at least one free radical-polymerizable monomer; b) about 0-20 % by weight of an adhesion promoter; c) about 10-80 % by weight of a primary low mole...  
WO/2000/071633A1
A self-adhesive protective film comprising a supporting layer and an adhesive layer, characterized in that the supporting layer is an undrawn film, said supporting layer contains at least one polypropylene block copolymer and the polypro...  
WO/2000/068218A1
Photoinitiators of formula (Ia) or (Ib) having chain transfer groups, wherein n is 1 or 2; PI is for example a group of formula (IIa); PI' inter alia is a group of formula (IIIa); Ar is for example phenyl; Ar¿2? is inter alia phenylene;...  
WO/2000/064973A1
The invention generally relates to novel compositions comprising (i) a styrenic block copolymer, and (ii) at least one polyphenylene ether resin having an intrinsic viscosity within the range of about 0.05 dl/g to about 0.60 dl/g, prefer...  
WO/2000/061695A1
The invention relates to a hot-melt adhesive of low viscosity which is obtained from A) at least one hydrocarbon resin that is solid at 20 °C and that has a softening temperature of 70 to 140 °C, and B) at least one oil with an average...  
WO/2000/058760A1
An optically active film composite comprising a transparent substrate and at least one layer of a block copolymer blend comprising between 30:70 to 70:30 percent by volume of each component of the copolymer, the block copolymer forming l...  
WO/2000/056796A1
Multiblock polyisoprene-polystyrene copolymers can be used with tackifier resins, plasticizer oil and antioxidants to formulate hot melt, pressure sensitive adhesives having an improved balance between tack, viscosity, bonding characteri...  
WO/2000/053842A1
The invention relates to a multilayered textile floor covering characterized in that the layers are glued with an adhesive containing as binder an aqueous dispersion of a mixture comprised of a polymer (A) consisting of at least 60 % by ...  
WO/2000/049091A1
The invention relates to a modifier for improving the behavior of bituminous mixtures used in road paving. Said modifier disperses easily in any given proportion and provides improved properties in comparison with traditional bituminous ...  
WO2000017285A9
A multilayer PSA construction includes a facestock, a hazy, first adhesive layer adjacent the facestock, and a PSA layer adjacent the first adhesive layer, and is protected until use by a release liner. The first adhesive layer includes ...  
WO/2000/044846A1
An adhesive material is suitable as a bioadhesive and comprises an adhesive polymer and a plasticiser therefor, wherein the adhesive is cross-linked, characterised in that the adhesive comprises ketone groups cross-linked by a polyamine ...  
WO/2000/039233A1
Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in...  
WO/2000/039189A1
An elecronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effect...  
WO/2000/037553A1
A combination of a low flexural modulus and low crystallinity polyolefin and a functionalized polyolefin were found to result in an olefin composition with excellent adhesion to metals and polar polymers (e.g. polyesters, polyamides, etc...  
WO/2000/034035A1
A release liner (10) which includes a metal layer (12) with a release agent (14) attached to a side of the metal layer (12). The release agent (14) is exposed to releasably receive an article (15). The metal layer (12) has a thickness su...  
WO/2000/026293A1
The present invention is directed to pressure sensitive hydrocolloid adhesive compositions having probe tack of about 300-750 grams force, tensile strength of about 500-3500 grams/cm?2¿ and saline absorbency of about 500-5000 grams/m?2...  
WO/2000/024840A1
A pressure sensitive adhesive composition comprising (a) a block copolymer composition comprising (i) a first component having a configuration of A-B, and (ii) a second component having a configuration of A-B-(B-A)¿n? where n ranges fro...  
WO/2000/023537A1
The invention relates to a hot-melt adhesive based on at least one thermoplastic elastomer, at least one hydrocarbon resin, at least one poly alpha olefin and at least one polar wax carrying a functional group. Said adhesives are suitabl...  
WO/2000/022061A1
Adhesive compositions are disclosed that include a block copolymer that includes monomers selected from the group consisting of styrene, isoprene, butadiene, and combinations thereof, from about 0.5 % to about 10 % by weight surfactant, ...  
WO/2000/022062A1
The present invention relates to a radiation-curable adhesive comprising: (a) a block copolymer comprising at least two mono-alkenyl aromatic hydrocarbon blocks and at least one butadiene block, wherein the 1,2-vinyl content in the butad...  
WO/2000/019986A1
A pharmaceutical preparation for transcutaneous absorption is disclosed which is practically suitable for emollition of prolonging pain such as zonary horpes or zonary postherpestic neuralgia, and is much excellent in pharmaceutical effe...  
WO/2000/017285A1
A multilayer PSA construction includes a facestock, a hazy, first adhesive layer adjacent the facestock, and a PSA layer adjacent the first adhesive layer, and is protected until use by a release liner. The first adhesive layer includes ...  
WO/2000/014170A1
A hot melt pressure sensitive adhesive for use with oriented polypropylene films is provided. The adhesive composition comprises an elastomeric component which is a blend of styrene-isoprene block copolymers and styrene-butadiene block c...  
WO/2000/013888A1
Die-cuttable and matrix-strippable adhesive constructions and accompanying methods of fabrication are disclosed. The adhesive constructions, which find utility as labels, comprise a coextrudate of a polymeric film (31) and an adhesive la...  
WO/2000/012645A1
The present invention relates to a hot melt adhesive composition, which is especially suited for use in disposables, and is comprised of: a) 100 parts by weight of a blend of: i) a linear block copolymer of the formula: A-B-A-D and/or A-...  
WO/2000/011056A1
A resin composition comprising either a vinyl polymer of a star structure having a crosslinkable silyl group at an end or a vinyl block copolymer having a star structure or having a lengthened chain; and a process for producing a vinyl b...  
WO/2000/009624A1
The present invention relates to an adhesive composition for use in a composite laminated structure comprising a substrate and an apertured layer joined together by means of the adhesive composition. The laminated structure is extensible...  
WO/2000/007981A1
The invention relates to a compound of formula (Ia), (Ib) or (Ic). The open chain alkoxyamine compounds are useful for the polymerization of ethylenically unsaturated monomers. The compounds of the present invention provide polymeric res...  
WO/2000/005291A1
A low noise pressure-sensitive adhesive tape is disclosed that includes a release coating that includes the reaction product of: (i) from 15-35 wt.-% silicone MQ-resins bearing one or more (meth)acrylate functional groups; (ii) from 50-8...  
WO/2000/004108A1
An improved hot-melt pressure-sensitive adhesive (HMPSA) composition contains an elastomeric component, such as a blend of SIS and SB block copolymers, and a tackifying component comprising one or more intermediate softening point resins...  
WO/2000/000565A1
A hot melt adhesive composition comprising a) from about 5 wt.% to about 50 wt.% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm?3¿...  
WO/2000/000564A1
This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65 °C and a thermoplastic polymer.  
WO/1999/066002A2
The invention relates to adhesive compositions having a modified polyethylene; an unmodified polyethylene of a certain density and a styrene-based elastomer. The styrene-based elastomer is present in a weight percentage of 10 to 45 wt. p...  
WO/1999/066000A1
The invention is an article comprising a hot melt PSA permanently adhered to at least one substrate wherein the adhesive has a shear adhesion failure temperature of greater than about 79 °C (175 °F). Preferably, the adhesive is pattern...  
WO/1999/064529A1
An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low m...  
WO/1999/063017A1
Cationic and hybrid radiation-curable pressure sensitive adhesive compositions for digital versatile discs and other substrates, a method for bonding versatile digital disc layers together with a cationic or hybrid radiation-curable pres...  
WO/1999/062998A1
This invention relates to a puncture-resisting tire composition comprising a thermoplastic elastomer, styrene-based block copolymer, as an active ingredient, unlike the conventional solvent-based rubber or emulsifier-based rubber contain...  
WO/1999/063020A1
This invention is directed to a tie layer for improving the adhesion of a layer of a fluoride-based polymeric material to a layer of a polyphenylene ether- or polystyrene-based material. The tie layer comprises a copolymer of a styrenic ...  
WO/1999/061543A1
There is provided a hot-melt adhesive composition which improves the non-uniform application pattern in the form of dotted particles of the hot-melt adhesive upon the application thereof in the melt blow manner, suppresses the bouncing p...  
WO/1999/058604A1
A poly(aromatic vinyl)/polyisoprene block copolymer composition comprising: 35 to 50 wt.%, excluding 50 wt.%, diblock polymer represented by the formula A-B [wherein A is a poly(aromatic vinyl) block and B is a polyisoprene block]; 23 to...  

Matches 701 - 750 out of 4,699