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Patent Searching and Data


Matches 351 - 400 out of 8,787

Document Document Title
WO2004007800A9
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...  
WO2004008054A9
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...  
WO/2005/003667A1
The present invention relates to a method of supporting vertically hanging electrical resistance elements for heating furnaces or ovens in industrial operation, wherein each element comprises current conducting legs (6) that run downward...  
WO/2004/110166A1
An air impingement oven having a conveyor belt assembly (30) for moving food through a heat treatment passage. The air impingement oven has a fan, a supply duct (42), a plenum (44) and a number of jet fingers (46) being disposed above th...  
WO2004008008A3
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...  
WO2004072323A3
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...  
WO/2004/105435A2
A heating assembly for use in an electric furnace includes a helical heating element encircled by thermal insulation, and rows of spacers for keeping turns of the heating element spaced apart by predetermined distances. Each spacer inclu...  
WO2004082867A3
A continuous casting installation includes a furnace (2) for heating metal to a first liquid metal temperature, a degassing unit (4), a filter (6), a heating unit (8) and a casting machine (10). The casting machine (10) includes a pair o...  
WO/2004/093161A1
The invention relates to a device and a method for thermally treating substrates, comprising an annular thermal treatment area that is provided with a rotary disk for accommodating substrate holders. Said substrate holders are arranged o...  
WO/2004/082867A2
A continuous casting installation includes a furnace (2) for heating metal to a first liquid metal temperature, a degassing unit (4), a filter (6), a heating unit (8) and a casting machine (10). The casting machine (10) includes a pair o...  
WO/2004/072323A2
A furnace incorporating a novel thermal design is disclosed. Heating element temperature is reduced compared to conventional designs while providing a precisely controlled process temperature in the range1000 - 1400 degrees centigrade. T...  
WO/2004/073051A1
A heater assembly for an ALD or CVD reactor provides protection for an electrical conductor associated with a heating element by using a purge gas to isolate the conductor from the corrosive environment of the reactor chamber. The purge ...  
WO2004007318A3
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO/2004/063651A1
A graphite electrode that can be effectively prevented from oxidizing and consuming during operation of an electric steel furnace, so that specific consumption of the electrode can be improved. The graphite electrode is used in an electr...  
WO2003096383A3
Methods and apparatus for selectively processing objects with a plasma formed in a cavity (12) with electromagnetic radiation. In one embodiment, a method can be provided that includes placing the object in the cavity (12) such that a fi...  
WO2004008493A9
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO2003096382A3
Apparatus and methods for plasma-process control are provided. One method relates to determining a physical condition of at least one object in a cavity (12) containing gas, where sufficient electromagnetic radiation is directed into the...  
WO2003096381A3
Methods and apparatus are provided for plasma-assisted processing multiple work pieces in a manufacturing line. In one embodiment, the method can include placing the work pieces (320) in movable carriers, moving the carriers on a conveyo...  
WO2003096380A3
Methods and systems (10) for plasma-assisted nitrogen surface-treatments are provided. The method can include subjecting a gas (24) to electromagnetic radiation (26) in the presence of a plasma catalyst (100, 120, 140) to initiate a plas...  
WO2004008491A3
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...  
WO/2004/044500A1
A gas heating method capable of directly and efficiently heating gas by using a heater not eroded by the gas and allowed to be rapidly heated and a small-sized and energy-saved gas heating device (10), the method comprising the steps of ...  
WO2004008493A3
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO2004008052A3
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...  
WO2003095058A3
Methods and apparatus for plasma-assisted processing of multiple parts are provided. Multi-part processing may include, for example, placing a plurality of parts (11) to be processed in or near a plurality of sub-regions of a cavity (12)...  
WO/2004/031342A1
A flexible heating cover assembly (200) for an apparatus for heating samples of biological material with substantial temperature uniformity includes a housing having a plurality of engageable enclosure components; a resistive heater (300...  
WO/2004/027845A1
A heat−treating apparatus comprising a reaction chamber accommodating an object to be treated, a heat−insulating body surrounding the reaction chamber, holes defined in the heat−insulating body, annular spacer members provided in t...  
WO/2004/025202A1
The aim of the invention is to prevent a detrimental effect on the operation of electric smelting furnaces. To achieve this, a pressure cell (41), which continuously measures the clamping force, is allocated to the actuating cylinder (21...  
WO2003067166A3
The invention concerns a core-type furnace whereof vertical sectors (20) of a crucible lateral wall are assembled at a position adjustable and invariable by screws (36) engaged in internal threads of a flange (34) common to all the secto...  
WO/2004/015348A1
A reactor chamber (130) is positioned between a top array of LED heat lamps (146) and a bottom array of LED heat lamps (148). The LED heat lamps (180) forming the top and bottom arrays (146, 148) are individually or controllable in group...  
WO2003096747A3
Apparatus and methods for plasma-assisted heating are provided. In one embodiment, a heating apparatus can include a cavity (14) for containing a gas. The cavity can have a thermally conductive wall and a radiation-transmissive wall. At ...  
WO/2004/007105A1
Various backfill injectors that provide upflowing gas and have improved uniformity of distribution of gas into the perimeter of the process chamber are provided for use in semiconductor wafer processing apparatus. Suitably optimized back...  
WO/2004/007778A1
The present invention provides a process plant for the production of molten steel from primary and/or secondary ferrous materials in which no free oxygen is permitted to contact directly carbon-containing iron melts, comprising: - i) at ...  
WO/2004/008008A2
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...  
WO/2004/008054A1
A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process cham...  
WO/2004/007318A2
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...  
WO/2004/007800A1
A thermal processing apparatus (100) is provided comprising a process chamber (102) and a vacuum system (104) for evacuating the process chamber. The vacuum system comprises a pump unit (124) in flow communication with the chamber and a ...  
WO/2004/008491A2
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...  
WO/2004/008052A2
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...  
WO/2004/008494A2
A method and system for controlling a servomotor network. The system has at least one local control node remotely located from a central processing area. The local control node actuates one or more servomotors, and is physically placed n...  
WO/2004/008493A2
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...  
WO/2004/001309A1
The invention relates to heat treatment of articles. In order to extend the functional capabilities of an electric furnace and improve the quality of the heat treatment therein, the power-supply system of an electric vacuum-annealing fur...  
WO2003066913A8
A method of heating molten aluminium flowing in a heated trough member comprising the steps of providing a source of molten aluminium and providing a trough member comprised of a first side (14) and a second side (18), the first and the ...  
WO/2003/096747A2
Apparatus and methods for plasma-assisted heating are provided. In one embodiment, a heating apparatus can include a cavity (14) for containing a gas. The cavity can have a thermally conductive wall and a radiation-transmissive wall. At ...  
WO/2003/095807A1
Methods and apparatus are provided for plasma-assisted engine exhaust treatment. In one embodiment, an engine exhaust treatment system includes at least one conduit with an inlet portion (215), an outlet portion (216), an intermediate po...  
WO/2003/096768A1
Methods and apparatus for plasma-assisted dry processing are provided. Dry processing may include, for example, treating the at least one part (11) by subjecting it to a plasma formed by subjecting it to a plasma formed by subjecting a f...  
WO/2003/096380A2
Methods and systems (10) for plasma-assisted nitrogen surface-treatments are provided. The method can include subjecting a gas (24) to electromagnetic radiation (26) in the presence of a plasma catalyst (100, 120, 140) to initiate a plas...  
WO/2003/096774A1
Methods and apparatus are provided for igniting, modulating, and sustaining a plasma for various plasma processes and treatments. In one embodiment, a plasma is ignited by subjecting a gas in a multi-mode processing cavity to electromagn...  
WO/2003/096383A2
Methods and apparatus for selectively processing objects with a plasma formed in a cavity (12) with electromagnetic radiation. In one embodiment, a method can be provided that includes placing the object in the cavity (12) such that a fi...  
WO/2003/095699A1
Methods and apparatus are provided for igniting, modulating, and sustaining a plasma (615) for coating objects (250). In one embodiment, a method of coating a surface of an object (250) includes forming a plasma (615) in a cavity (230) b...  
WO/2003/096770A1
Methods and apparatus are provided for igniting, modulating, and sustaining plasma (615) for various coating processes. In one embodiment, the surface of an object can be coated (247) by forming plasma in a cavity (230) with walls (232) ...  

Matches 351 - 400 out of 8,787