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JP5108100B2 |
A manufacturing yield of a semiconductor device (capacitive micromachined ultrasonic transducer) is increased. A plurality of first chips 1 in which a plurality of cells each having functions of transmitting and receiving ultrasonic wave...
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JP5109959B2 |
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JP5104506B2 |
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JP5104429B2 |
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JP5100154B2 |
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JP5099224B2 |
A vibratory plate includes a first layer (3) containing a fiber material and having a first surface and a second surface opposing the first surface, a second layer (2) containing a sliced natural wood in the form of a single sheet having...
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JP5104350B2 |
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JP5095593B2 |
In an ultrasonic probe in which individual wires led out from multilayered piezoelectric elements are arranged in a staggered manner, short-circuit is prevented. Each of the elements includes: a multilayered structure in which piezoelect...
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JP5098790B2 |
To provide an organic piezoelectric material film with which insulation breakdown will not occur at polarization processing, and to provide a method of forming the same. In a method of manufacturing an organic piezoelectric material film...
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JP5094404B2 |
A geometrically shaped acoustic polymer ribbon with shape memory, high conductivity, high toughness. A method of manufacturing the ribbon comprises: forming a sized, elongated, coated or coatable polymeric substrate film between a pair o...
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JP2012235925A |
To provide an ultrasonic transducer capable of broadening the frequency band of emitted ultrasonic waves in a simple and damage proof structure.The ultrasonic transducer is characterized by including a piezoelectric element 1, an upper e...
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JP2012531036A |
The present invention relates to a method of manufacturing a piezoelectric ceramic body and devices therefrom. The method comprises mixing a piezoelectric ceramic powder with a polymer binder and surfactant to form a slip mixture, castin...
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JP5090641B2 |
Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual transducers, testing the individual transduc...
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JP5088377B2 |
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JP5087883B2 |
To provide a method of manufacturing a semiconductor device and a substrate for improving a yield of semiconductor device, in which an electron element is formed on the surface of the substrate. A projection part formation step for formi...
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JP5085717B2 |
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JP5084764B2 |
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JP5083210B2 |
A driving method of an array type ultrasound probe, in which transmission and reception are carried out by changing a voltage load alternatively on the transmission piezoelectric element and the reception piezoelectric element.
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JP5083369B2 |
This invention provides an acoustic sensor capable of increasing the length of the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On a...
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JP5085503B2 |
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JP5082401B2 |
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JP5080621B2 |
The present invention relates to a thermoacoustic device that includes an acoustic element. The acoustic element includes a substrate, a plurality of microspaces, and a metal film. The metal film is located above the substrate. A plurali...
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JP5076720B2 |
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JP5079485B2 |
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JP5075668B2 |
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JP2012529207A |
A component having a robust, but acoustically sensitive microphone structure is provided and a simple and cost-effective method for its production. This microphone structure includes an acoustically active diaphragm, which functions as d...
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JP5071211B2 |
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JP2012217029A |
To prevent polarization characteristics of a piezoelectric material from being lost during driving an oscillation device having a piezoelectric vibrator and improve the reliability of an electronic apparatus.An oscillation device include...
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JP5065974B2 |
A microphone unit includes a substrate. The substrate includes a first face formed with a first recess, a second face opposite to the first face, and a through hole communicating the second face to a bottom part of the first recess. A di...
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JP5070026B2 |
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JP5055203B2 |
The adsorption stability with respect to a fixed pole is increased while the low frequency response of a diaphragm is improved especially in an electret condenser microphone. In a diaphragm 11 for a condenser microphone, which is formed ...
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JP5058746B2 |
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JP5058851B2 |
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JP5055238B2 |
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JP5057572B2 |
In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the...
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JPWO2010119600A1 |
Provided is a converter module that can be easily miniaturized and reduced in height without impairing the pressure detection sensitivity. The converter module (100) includes a converter (110) that converts the vibration of the diaphragm...
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JP2012199389A |
To provide a manufacturing method of a piezoelectric device that is insulated from the influence of static electricity.On a substrate 20 are formed a plurality of piezoelectric elements 11A and 11B each including a piezoelectric substanc...
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JP5049571B2 |
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JP5053124B2 |
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JP5053143B2 |
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JP5049312B2 |
A raised micro-structure is disclosed for use in a silicon based device. The raised micro-structure comprises a generally planar film having a ribbed sidewall supporting the film.
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JP5051893B2 |
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JP5052850B2 |
The present invention relates to a loudspeaker case ultrasonic deposition joining method, forming steps at the peripheral wall of a pair of case sheets (1), (2) of cutting mechanism composed of same thermoplastic resin thereby forming in...
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JP5049340B2 |
An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wav...
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JP5046982B2 |
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JP5038097B2 |
To obtain a ribbon microphone unit, which makes the tension of a diaphragm adjustable by configuring a ribbon diaphragm assembly that is detachable to a magnetic-circuit assembly including a magnet, and which further allows a user side t...
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JP5038865B2 |
A plurality of piezoelectric elements are arrayed two-dimensionally. A plurality of electrodes are respectively formed on the plurality of piezoelectric elements. A plurality of non-conductive members have columnar shape and are arranged...
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JP5032501B2 |
An MEMS sensor constructed on a base chip and having a capacitive mode of operation is disclosed. The MEMS sensor has a patterned layer construction applied on the base chip. A cutout is produced in the layer construction, the moveable e...
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JP2012182683A |
To provide a semiconductor device in which stress applied from a substrate to a semiconductor element can be sufficiently absorbed, and a method for manufacturing the same.A semiconductor device 10 according to one embodiment of the pres...
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JPWO2010106733A1 |
At least one semiconductor device that can prevent the intrusion of cutting water and cutting debris during processing for individualization and improve reliability is mounted on the substrate (6) and the main surface of the substrate (6...
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