Title:
半導体用接着フィルム及びこれを用いた半導体装置
Document Type and Number:
Japanese Patent JP3754700
Kind Code:
B1
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Inventors:
Hiroyuki Yasuda
Nakagawa Daisuke
Nakagawa Daisuke
Application Number:
JP2004370028A
Publication Date:
March 15, 2006
Filing Date:
December 21, 2004
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L21/52; C09J7/00; C09J133/08; C09J161/06; C09J163/00; C09J201/00
Domestic Patent References:
| JP108001A |
Attorney, Agent or Firm:
Shinji Hayami