Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
基板検出装置および基板処理装置
Document Type and Number:
Japanese Patent JP4762209
Kind Code:
B2
More Like This:
JPH04152654WAFER HANDLING ARM
JP2702836DIE-BONDING DEVICE
JPS53112673MASK ALIGNMENT METHOD IN SEMICONDUCTOR DEVICE MANUFACTURING PROCESS AND PHOTO MASK USED FOR ITS EXECUTION
Inventors:
Yasushi Sasa
Hiroyuki Onishi
Application Number:
JP2007193956A
Publication Date:
August 31, 2011
Filing Date:
July 25, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/68; G06T1/00; H01L21/304; H01L21/306
Domestic Patent References:
JP11243130A
JP63128733U
JP11312725A
JP2000174103A
JP11176912A
JP11085997A
JP6337961A
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita



 
Previous Patent: 静電チャックヒータ

Next Patent: エレベータ