To suppress degradation in the characteristics of a ferroelectric memory under utilization environments or during manufacturing processes of the ferroelectric memory.
The ferroelectric memory comprises a semiconductor substrate 10; a transistor formed on the semiconductor substrate 10; a capacitor 50 formed on the upper part of the semiconductor substrate 10 and includes a first electrode 54, a first ferroelectric layer 56 formed on the first electrode 54, and a second electrode 58 formed on the first ferroelectric layer 56; and a laminated barrier layer 60 formed so as to coat the capacitor 50 and having a first insulating layer, a second ferroelectric layer formed on the first insulating layer, and a second insulating layer formed on the second ferroelectric layer.
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Mitsue Obuchi