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Patent Searching and Data


Title:
有機EL装置および電子機器
Document Type and Number:
Japanese Patent JP5593630
Kind Code:
B2
Abstract:

To provide an organic EL device with high mechanical strength and excellent sealing properties.

In the organic EL device 1, an organic EL panel 2 and a wiring board 3A are pinched by a pair of film sheets 41A, 41B, which 41A, 41B are bonded together at a peripheral edge part of the organic EL panel 2, whereby, the organic EL panel 2 is sealed inside the film sheets 41A, 41B. First sealing resin layers 43 are formed, respectively, at a gap 4H between the film sheets 41A, 41B and the organic EL panel 2 and at a gap 4H between the film sheets 41A, 41B formed at an end face of the wiring board 3A and the wiring board 3A, and the gaps 4H are sealed.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
Gyoda Kozo
Yamada Positive
Application Number:
JP2009088721A
Publication Date:
September 24, 2014
Filing Date:
April 01, 2009
Export Citation:
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Assignee:
Seiko Epson, Inc.
International Classes:
H05B33/04; G09F9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/02; H05B33/10
Attorney, Agent or Firm:
Masaaki Kamiyanagi
Osamu Suzawa
Kazuhiko Miyasaka