Title:
熱硬化性シリコーン樹脂組成物およびその成形体を使用した光半導体装置
Document Type and Number:
Japanese Patent JP6540619
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting silicone resin composition which gives a cured product that is excellent in fluidity at the time of molding, and is excellent in toughness, particularly, flexibility after secondary curing, and to provide an optical semiconductor device using the same.SOLUTION: A thermosetting silicone resin composition contains (A) a condensation reaction type resin-like organopolysiloxane being a solid at 25°C of 70-95 pts.mass, (B) organopolysiloxane which has a straight chain diorganopolysiloxane residue and has at least one cyclohexyl group or phenyl group in one molecule of 2-30 pts.mass, (C) an acrylic resin-based modifier having an alkoxysilyl group and a weight average molecular weight of 1,000-20,000 of 2-20 pts.mass (total of components (A), (B) and (C) is 100 pts.mass), (D) an inorganic filler: 300-1,200 pts.mass, and (E) an organic metal condensation catalyst: 0.01-5 pts.mass.SELECTED DRAWING: None
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Inventors:
Yoshihiro Tsutsumi
Tadashi Tomita
Tadashi Tomita
Application Number:
JP2016135657A
Publication Date:
July 10, 2019
Filing Date:
July 08, 2016
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/06; C08K3/00; C08L33/14; H01L23/29; H01L23/31; H01L31/12; H01L33/56
Domestic Patent References:
| JP2015229749A | ||||
| JP2005008755A | ||||
| JP2012524835A | ||||
| JP2011032392A | ||||
| JP2009221393A | ||||
| JP2012184364A | ||||
| JP2004292638A |
Attorney, Agent or Firm:
Mamoru Ushiki