Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP6713370
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method which can increase a processing efficiency by drops of a process liquid while suppressing a damage to a substrate, and to provide a substrate processing device arranged so that a protective liquid nozzle can be prevented from touching a substrate without fail.SOLUTION: A substrate processing device 1 comprises a drop nozzle 5. The drop nozzle 5 has: a first drops head part 7 for spraying drops of a process liquid to a first spray region in an upper face of a substrate W; and a second drops head part 8 for spraying drops of a process liquid to a second spray region in an upper face of the substrate W. The first drops head part 7 and the second drops head part 8 are attached to a nozzle arm 9. The substrate processing device 1 further comprises: a first protective liquid nozzle 11 for covering the first spray region with the protective liquid; and a second protective liquid nozzle 11 for covering the second spray region with the protective liquid.SELECTED DRAWING: Figure 2
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Inventors:
Masahiko Kato
Hiroyuki Yashiki
Hiroyuki Fujiki
Hiroyuki Yashiki
Hiroyuki Fujiki
Application Number:
JP2016151441A
Publication Date:
June 24, 2020
Filing Date:
August 01, 2016
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; H01L21/027
Domestic Patent References:
| JP2011029315A | ||||
| JP2012216777A | ||||
| JP2008306108A | ||||
| JP2014150135A | ||||
| JP2001203182A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office