Document Type and Number:
Japanese Patent JPH02759
Kind Code:
U
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JP2896751 | [Title of Invention] Adhesive Tape for Electronic Components |
Application Number:
JP7721188U
Publication Date:
January 05, 1990
Filing Date:
June 10, 1988
Export Citation:
International Classes:
H01L23/40; H01S5/00; (IPC1-7): H01S3/18; H01L23/40
Domestic Patent References:
JP61085175B | ||||
JPS6149467B2 | 1986-10-29 |