Title:
窒化物半導体基板用研磨剤組成物
Document Type and Number:
Japanese Patent JP6788474
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing agent composition capable of polishing a nitride semiconductor substrate at a high polishing rate and further improving surface smoothness of the nitride semiconductor substrate.SOLUTION: The polishing agent composition includes a metal acid and/or a metal acid salt, abrasive grains, an oxygen donating agent, and water. The pH value (25°C) is 0.1 or more and less than 7.0. It is preferable that the metal acid and/or the metal acid salt is at least one selected from the group consisting of molybdic acid and/or molybdate, tungstic acid and/or tungstate, vanadic acid and/or vanadate.SELECTED DRAWING: None
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Inventors:
Kei Suga
Application Number:
JP2016204238A
Publication Date:
November 25, 2020
Filing Date:
October 18, 2016
Export Citation:
Assignee:
Yamaguchi Seiken Industry Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2010284784A | ||||
| JP2015229750A | ||||
| JP2014205756A |
Foreign References:
| WO2013133198A1 | ||||
| WO2013035539A1 | ||||
| US20050155296 |
Attorney, Agent or Firm:
Ippei Watanabe
Shigeru Koike
Nagaoka Norio
Shigeru Koike
Nagaoka Norio