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Patent Searching and Data


Title:
ASSEMBLING APPARATUS FOR SUBSTRATE
Document Type and Number:
Japanese Patent JPS63273390
Kind Code:
A
Abstract:

PURPOSE: To eliminate auxiliary parts, such as a connecting tool and a clamping tool by composing a metal base material of one continuous substrate continuously bent in a wave shape.

CONSTITUTION: Electronic component group 3 is soldered to a metal base substrate before bending. Both ends are grasped by a movable clamp 7, and its center is clamped by a stationary clamp 6. The center between the clamps 6 and 7 is lifted vertically by cutting edges 4, 5, the clamp 7 is simultaneously moved horizontally to the clamp 6 at the same speed to form a wave shape. The clamps are removed to complete a bent metal base substrate 2b. Since auxiliary parts are not required, an effective mounting area is increased, and since a connector between the substrates is eliminated, its connecting reliability is enhanced.


Inventors:
GOTO MOTOYUKI
Application Number:
JP10931387A
Publication Date:
November 10, 1988
Filing Date:
April 30, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K1/05; H05K1/00; H05K1/02; H05K3/00; H05K3/34; (IPC1-7): H05K1/02; H05K1/05
Attorney, Agent or Firm:
Masuo Oiwa