Title:
COPPER-CLAD LAMINATED PLATE
Document Type and Number:
Japanese Patent JP3383440
Kind Code:
B2
Abstract:
PURPOSE: To obtain a copper-clad laminated plate which has high copper coil adhesive strength, high glass transition point and excellent heat resistance by using prepreg containing epoxy resin composition with dicyandiamide as curing agent on the front surface layer of the prepreg and prepreg containing the same composition with novolak resin as curing agent at the central layer.
CONSTITUTION: Prepreg I is so superposed by coating glass woven fabric with epoxy resin composition with dicyanamide as curing agent, impregnating and drying on a surface layer, and prepreg II is so disposed by coating the glass nonwoven fabric with epoxy resin composition with novolak resin as curing agent at the central layer as to be superposed, a copper foil is superposed at least one side surface of the prepreg I of the superposed surface, molded integrally by heating and pressurizing, thereby easily manufacturing a copper- clad laminated plate. Thus, the two types of the different curing agents are used to provide excellent copper-clad adhesion strength, high glass transition point, and excellent heat resistance at the time of soldering.
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Inventors:
Nobuhiko Uchida
Tsuyoshi Sugiyama
Tsuyoshi Sugiyama
Application Number:
JP26446594A
Publication Date:
March 04, 2003
Filing Date:
October 04, 1994
Export Citation:
Assignee:
Kyocera Chemical Corporation
International Classes:
C08J5/24; B32B15/08; B32B17/04; B32B27/04; H05K1/03; (IPC1-7): B32B15/08; H05K1/03
Domestic Patent References:
| JP381140A | ||||
| JP3230948A | ||||
| JP1261428A | ||||
| JP6100707A |
Attorney, Agent or Firm:
Eiji Morota