Cu ALLOY FILM, AND DISPLAY DEVICE OR ELECTRONIC DEVICE HAVING THE SAME

Japanese Patent JP2012212064

A

To provide a novel Cu alloy film which has high adhesion to a substrate and/or an insulation film and exhibits low electric resistivity even after a thermal treatment performed in a manufacturing process for a liquid crystal display device or the like.

There is provided a Cu alloy film for a display device and the Cu alloy film is made of a Cu-Mn-B alloy. If a Mn amount and a B amount in the depth direction of 50 nm (II) from the interface (I) of a substrate side of the Cu alloy film to the outermost surface of the Cu alloy film are defined as a Mn amount (Mn_I-II) and a B amount (B_I-II), respectively, and if a Mn amount and a B amount in the depth direction from the depth of 50 nm (II) of the Cu alloy film to the outermost surface (III) of the Cu alloy film are defined as a Mn amount (Mn_II-III) and a B amount (B_II-III), respectively, the relation between Mn_I-II and Mn_II-III of the Mn amount satisfies 2.0≤(Mn_I-II/Mn_II-III) and the relation between B_I-II and B_II-III of the B amount satisfies 1.5≤(B_I-II/B_II-III).

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JP2000077825	MANUFACTURE OF WIRING BOARD HAVING TRANSPARENT CONDUCTING LAYER
JP2009216980	METHOD OF MANUFACTURING LIQUID CRYSTAL DEVICE

FUKU KATSUFUMI
NAKAI JUNICHI
GOTO YASUSHI
MIKI AYA

JP2011078280A

November 01, 2012

March 31, 2011

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KOBE STEEL LTD

G02F1/1343; G09F9/30; H01L21/3205; H01L21/768; H01L23/532; H01L29/786; H01L51/50; H05B33/26

JP2010098300A	2010-04-30
JP2009097085A	2009-05-07
JP2010098300A	2010-04-30

WO2011013683A1

2011-02-03

Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito
Akemi Takeoka

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