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Patent Searching and Data


Title:
HEAT DISTRIBUTION MEASURING APPARATUS
Document Type and Number:
Japanese Patent JP2005337739
Kind Code:
A
Abstract:

To provide a heat distribution measuring apparatus enabling to extensively and instantly measure a heat distribution image of a narrow part and a normal image, and measure heat distribution even if electronic equipment of a mounting board is energized.

The present invention displays a heat distribution image of a board taken by an infrared camera 8 on a display device 9 by sending an infrared ray of a mounting board 6b, which is an object to be measured, to the infrared camera 8 through an optical probe 1. The each edge of the optical probe 1 is fixed to an arrangement member 3 made from a non-conductive material and on which a plurality of through holes are formed at predetermined intervals and the through holes formed on the arrangement member 3. The optical probe 1 are arranged two-dimensionally against the arrangement member 3 and captures a visible image or an infrared image of a light detecting surface of the object to be measured. The optical probe 1 comprises a plurality of optical fibers 5 made from a non-conductive material and is provided in a cover 4 made from a non-conductive material which sends the image to an infrared camera 8 provided at the other end of the optical probe 1.


Inventors:
SAWADA AKIRA
Application Number:
JP2004153295A
Publication Date:
December 08, 2005
Filing Date:
May 24, 2004
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G01N25/18; G01J5/08; G01J5/10; (IPC1-7): G01J5/08; G01J5/10; G01N25/18
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto