Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2023151039
Kind Code:
A
Abstract:
To provide a hot-melt adhesive which can be bonded by thermocompression, has excellent adhesion to a base material, and is also excellent in hot water resistance, acid resistance and alcohol resistance.SOLUTION: A hot-melt adhesive contains a crosslinked product of an adhesive composition containing a crosslinking agent, and contains a polyurethane resin (A), an epoxy resin (B) and an isocyanate-based crosslinking agent (C), wherein the epoxy resin (B) contains a hydroxyl group-containing epoxy resin, having a hydroxyl group, with an epoxy equivalent of 450 g/eq or more and 3,000 g/eq or less, and the polyurethane resin (A) has a structural unit derived from a polyol (a1) with a skeleton having 8 or more carbon atoms.SELECTED DRAWING: None
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Inventors:
IINO SHOTA
MIWA YUYA
MIWA YUYA
Application Number:
JP2022060433A
Publication Date:
October 16, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
DAINICHISEIKA COLOR CHEM
International Classes:
C09J5/06; C09J175/04; C09J11/06; C09J163/00
Attorney, Agent or Firm:
Patent Attorney Corporation Fujimoto Partners