Title:
MANUFACTURING METHOD OF ELECTRONIC CIRCUIT DEVICE AND ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP3804649
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic circuit device whereby forming accuracy of bumps is enhanced to reduce a positional deviation between a chip electrode center and a connected bump center and contrast of recognizing an image of a recognized bump can easily be obtained and to provide the electronic circuit device.
SOLUTION: A circuit element 10 having electrodes on one principal face and a substrate 1 having an electrode 2 for the connected bump and an electrode 3 for the recognized bump located on its one principal face are prepared, and the connected bump 12 and the recognized bump 13 are formed respectively to the electrode 2 for the connected bump and the electrode 3 for the recognized bump by using the wire bonding method. The position of the recognized bump 13 is detected on the basis of an image of the recognized bump 13 photographed by using an optical means 30 and the circuit element 10 is joined onto the substrate 1 via the connected bump 12 on the basis of the position. Since the upper part of the recognized bump 13 is formed to be a projection, contrast with the electrode 3 can easily be obtained and the position of the recognized bump 13 can accurately be detected.
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Inventors:
Ryuji Kimura
Maeda Takenobu
Toru Iebe
Maeda Takenobu
Toru Iebe
Application Number:
JP2003327055A
Publication Date:
August 02, 2006
Filing Date:
September 19, 2003
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L21/60; H01L23/485; H01L23/544; H05K1/02; H05K3/30; H05K3/40; (IPC1-7): H01L21/60
Domestic Patent References:
| JP1112743A | ||||
| JP10012671A |
Attorney, Agent or Firm:
Hidetaka Tsutsui
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