Title:
MANUFACTURING METHOD OF WIRING STRUCTURE
Document Type and Number:
Japanese Patent JP2013098400
Kind Code:
A
Abstract:
To provide a wiring structure which is processed by short-time laser radiation and allows unnecessary metals to be recycled.
A manufacturing method of a wiring structure of this invention includes the steps of: radiating a laser beam 52a to metal foil 14 formed on the first surface side of a resin film 10 thereby cutting the metal foil 14 at a boundary part of metal wiring; radiating a laser beam 52b to the metal foil 14 from the second surface side of the resin film 10 which is opposite to the first surface side thereby peeling an unnecessary part 14a of the metal foil 14 from the resin film 10; and removing the unnecessary part 14a of the metal foil 14 from the resin film 10.
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Inventors:
KURASAKA TSUGIO
OTSUKA CHOJI
MORI MASANORI
OTSUKA CHOJI
MORI MASANORI
Application Number:
JP2011240815A
Publication Date:
May 20, 2013
Filing Date:
November 02, 2011
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
H05K3/08; H01P11/00; H01Q1/38; H05K3/22
Attorney, Agent or Firm:
Ryosuke Fujimoto