Title:
MATERIAL FOR THIXOMOLDING, MANUFACTURING METHOD OF MATERIAL FOR THIXOMOLDING, AND THIXOMOLDED BODY
Document Type and Number:
Japanese Patent JP2022153979
Kind Code:
A
Abstract:
To provide a thixomolded body with high rigidity, and to provide a material for thixomolding capable of manufacturing such a thixomolded body and a manufacturing method thereof.SOLUTION: A material for thixomolding includes: a metal body mainly composed of Mg; and a coating part containing Si particles adhering on the surface of the metal body via a binder, and mainly composed of Si. An average particle diameter of the Si particles is 1 μm or more and 100 μm or less, and a mass fraction of the Si particles with respect to the total mass of the metal body and the Si particles is 1.0 mass% or more and 30.0 mass% or less. Further, the binder preferably contains waxes. Furthermore, the content of the binder is preferably 0.001 mass% or more and 0.200 mass% or less.SELECTED DRAWING: Figure 2
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Inventors:
MAEDA IKUYA
HIDESHIMA YASUTOSHI
IWASHITA SETSUYA
UCHIZONO SHUNSUKE
OZAKI KOICHI
FUKUDA TADAO
HIDESHIMA YASUTOSHI
IWASHITA SETSUYA
UCHIZONO SHUNSUKE
OZAKI KOICHI
FUKUDA TADAO
Application Number:
JP2021056781A
Publication Date:
October 13, 2022
Filing Date:
March 30, 2021
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B22D17/00; C22C1/02; C22C23/00
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura