Title:
MATERIAL FOR ULTRA THIN COPPER ALLOY WIRE AND ITS METHOD OF MANUFACTURING
Document Type and Number:
Japanese Patent JP3941304
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the material for ultra thin copper alloy wire with superior tensile strength, electrical conductivity and wire drawability, and good quality of elongation, and its manufacturing method.
SOLUTION: The material for ultra thin copper alloy wire is made from an alloy of highly purified copper martix containing inevitable impurities of the total sum of not more than 10 ppm, containing 0.05-0.9 wt.% of one or more than two kinds of metallic elements chosen from Sn, In, Ag, Sb, Mg, Al and B, and the material is drawn into the wire with final diameter of not more than 0.08 mm, and annealed.
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Inventors:
Matsui quantity
Takaro Ichikawa
Koichi Tamura
Masayoshi Aoyama
Osamu Seya
Ryohei Okada
Takaro Ichikawa
Koichi Tamura
Masayoshi Aoyama
Osamu Seya
Ryohei Okada
Application Number:
JP33001299A
Publication Date:
July 04, 2007
Filing Date:
November 19, 1999
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01B1/02; C22C9/00; C22C9/02; C22F1/00; C22F1/08; H01B5/02; H01B5/08; (IPC1-7): H01B1/02; C22C9/00; C22F1/08; H01B5/02; H01B5/08; //C22F1/00
Domestic Patent References:
| JP2232327A | ||||
| JP6240388A | ||||
| JP5311285A | ||||
| JP2243733A | ||||
| JP2022431A | ||||
| JP54097543A | ||||
| JP63061703U |
Attorney, Agent or Firm:
Nobuo Kinutani
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