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Title:
METHOD FOR CONNECTING LOW MELTING POINT MATERIAL
Document Type and Number:
Japanese Patent JP2000301354
Kind Code:
A
Abstract:

To connect low melting point materials by electric heating with an excellent power factor without increasing the size of a power source equipment and without complicating the structure.

Low melting point materials 1, 2 are inserted into an outer cylinder 3 formed into a cylindrical shape with a material having a melting point higher than the low melting point materials 1, 2 to be connected. The low melting point materials 1, 2 are butted against each other within the outer cylinder 3 via an interval S. The outer cylinder 3 is electrically heated, butting parts of the low melting point material 1, 2 are molten by heating of the outer cylinder 3, and the molten low melting point materials 1, 2 are pressurized to come into press-contact.


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Inventors:
YOSHIDA HISASHI
YASHIRO KENJI
TANAKA MASAO
ISHII MIYUKI
Application Number:
JP10582899A
Publication Date:
October 31, 2000
Filing Date:
April 13, 1999
Export Citation:
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Assignee:
HAKUSAN MFG CO LTD
International Classes:
B23K20/00; B23K1/00; B23K20/22; H01R4/02; B23K101/32; B23K101/38; B23K103/10; B23K103/12; (IPC1-7): B23K20/00; B23K1/00; B23K20/22; H01R4/02
Attorney, Agent or Firm:
Yoshiharu Yoshida



 
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