Title:
MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2023109770
Kind Code:
A
Abstract:
To miniaturize a mounting board having a light-receiving element and a light-emitting element.SOLUTION: In an electronic device, a mounting substrate includes a substrate 2 having a base portion 2a and a frame portion 2b. The base portion 2a includes a first top surface 6a including a first mounting area 4a. The frame portion 2b includes a second upper surface 6b including a second mounting area 4b, and an inner wall surface 7 intersecting with the second upper surface 6b. The inner wall surface 7 of the frame portion 2b includes a first portion 7a connected to the second upper surface 6b, and a second portion 7b located opposite the first portion 7a with the first mounting area 4a interposed therebetween. A first film 6 that absorbs light by having a reflectance lower than that of the inner wall surface of the frame portion is positioned on the second portion 7b.SELECTED DRAWING: Figure 1B
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Inventors:
FUNAHASHI AKIHIKO
Application Number:
JP2023073840A
Publication Date:
August 08, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/02; H01L31/12; H01L33/62
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK