To provide a printed circuit board wherein a thermally protected component can be thermally protected without lowering the temperature of a heating component to the same level as the temperature of the thermally protected component.
In the multilayer printed circuit board (PCB), a heating component (101) that operates at a first proof temperature (TS1), and a thermally guaranteed component (102) that operates at a second proof temperature (TS2) lower than the first proof temperature (TS1), are mounted over a first single-layer substrate (S1a). Second single-layer substrates (S2a, S4a) are provided with first solid layers (LG1a, LP1a) and second solid layers (LG2a, LP2a). When the second single-layer substrate is laid on the first single-crystal substrate (S1a), the first solid layer is positioned under the heating component (101) and the second solid layer is positioned under the thermally guaranteed component (102).
JPH07235759 | PRINTED CIRCUIT BOARD |
JP2002016324 | ROTATION SUBSTRATE AND ITS MANUFACTURING METHOD |
JP2003100989A | 2003-04-04 | |||
JP2005094405A | 2005-04-07 | |||
JPH10335866A | 1998-12-18 | |||
JPH0193792U | 1989-06-20 | |||
JPH0513894A | 1993-01-22 | |||
JP2003204013A | 2003-07-18 | |||
JP2004356565A | 2004-12-16 | |||
JPH06125156A | 1994-05-06 | |||
JP2004153142A | 2004-05-27 | |||
JPH1140901A | 1999-02-12 |
Next Patent: METHOD AND EQUIPMENT FOR POLISHING WAFER